Kent Allen Douglas

US Patent:

7800735, Sep 21, 2010

Filed:

May 30, 2006

Appl. No.:

11/420985

Inventors:

Salam Harb - Los Gatos CA, US
Kent Douglas - San Martin CA, US
James Haslim - Dublin CA, US
Jon Hamilton - Alameda CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G03B 27/58

US Classification:

355 72

Abstract:

Substrate support apparatus and methods are described. Motion of a substrate chuck relative to a stage mirror may be dynamically compensated by sensing a displacement of the substrate chuck relative to the stage mirror and coupling a signal proportional to the displacement in one or more feedback loops with Z stage actuators and/or XY stage actuators coupled to the stage mirror. Alternatively, a substrate support apparatus may include a Z stage plate a stage mirror, one or more actuators attached to the Z stage plate, and a substrate chuck mounted to the stage mirror with constraints on six degrees of freedom of movement of the substrate chuck. The actuators impart movement to the Z stage in a Z direction as the Z stage plate is scanned in a plane perpendicular to the Z direction. The actuators may include force flexures having a base portion attached to the Z stage plate and a cantilever portion extending in a lateral direction from the base portion. The cantilever portion may include a parallelogram flexure coupled between the base portion and a free end of the cantilever portion.

US Patent:

8390789, Mar 5, 2013

Filed:

Aug 3, 2010

Appl. No.:

12/849718

Inventors:

Salam Harb - Los Gatos CA, US
Kent Douglas - San Martin CA, US
James Haslim - Dublin CA, US
Jon Hamilton - Alameda CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G03B 27/58

US Classification:

355 72

Abstract:

Substrate support apparatus and methods are disclosed. Motion of a substrate chuck relative to a stage mirror may be dynamically compensated by sensing a displacement of the substrate chuck relative to the stage mirror and coupling a signal proportional to the displacement in one or more feedback loops with Z stage actuators and/or XY stage actuators coupled to the stage mirror. Alternatively, a substrate support apparatus may include a Z stage plate a stage mirror, one or more actuators attached to the Z stage plate, and a substrate chuck mounted to the stage mirror with constraints on six degrees of freedom of movement of the substrate chuck. The actuators impart movement to the Z stage in a Z direction as the Z stage plate is scanned in a plane perpendicular to the Z direction. The actuators may include force flexures having a base portion attached to the Z stage plate and a cantilever portion extending in a lateral direction from the base portion. The cantilever portion may include a parallelogram flexure coupled between the base portion and a free end of the cantilever portion.

US Patent:

20020075385, Jun 20, 2002

Filed:

Jan 31, 2002

Appl. No.:

10/066161

Inventors:

Scott Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent Douglas - San Martin CA, US
Fred Babian - Boulder Creek CA, US

Assignee:

KLA INSTRUMENTS CORPORATION

International Classification:

H04N007/18

US Classification:

348/087000, 348/086000, 348/095000, 382/141000, 382/151000

Abstract:

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

US Patent:

20030063190, Apr 3, 2003

Filed:

Dec 9, 2002

Appl. No.:

10/314546

Inventors:

Scott Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent Douglas - San Martin CA, US
Fred Babian - Boulder Creek CA, US

Assignee:

KLA INSTRUMENTS CORPORATION

International Classification:

G06K009/00

US Classification:

348/126000, 382/151000, 348/129000

Abstract:

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

US Patent:

20050254698, Nov 17, 2005

Filed:

Jul 13, 2005

Appl. No.:

11/180348

Inventors:

Scott Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent Douglas - San Martin CA, US
Fred Babian - Boulder Creek CA, US

International Classification:

G06K009/00
H04N007/18

US Classification:

382145000, 348087000

Abstract:

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

US Patent:

20080304734, Dec 11, 2008

Filed:

Aug 7, 2008

Appl. No.:

12/221806

Inventors:

Scott A. Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt H. Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent E. Douglas - San Martin CA, US
Fred E. Babian - Boulder Creek CA, US

International Classification:

G06K 9/00

US Classification:

382141

Abstract:

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

US Patent:

20130176548, Jul 11, 2013

Filed:

Mar 4, 2013

Appl. No.:

13/784402

Inventors:

Salam Harb - Los Gatos CA, US
Kent Douglas - San Martin CA, US
Marek Zywno - San Jose CA, US
James Haslim - Dublin CA, US
Jon Hamilton - Alameda CA, US

Assignee:

KLA-Tencor Corporation - Milpitas CA

International Classification:

G03F 7/20

US Classification:

355 72, 74470

Abstract:

Substrate support apparatus and methods are disclosed. Motion of a substrate chuck relative to a stage mirror may be dynamically compensated by sensing a displacement of the substrate chuck relative to the stage mirror and coupling a signal proportional to the displacement in one or more feedback loops with Z stage actuators and/or XY stage actuators coupled to the stage mirror. Alternatively, a substrate support apparatus may include a Z stage plate a stage mirror, one or more actuators attached to the Z stage plate, and a substrate chuck mounted to the stage mirror with constraints on six degrees of freedom of movement of the substrate chuck. The actuators impart movement to the Z stage in a Z direction as the Z stage plate is scanned in a plane perpendicular to the Z direction. The actuators may include force flexures having a base portion attached to the Z stage plate and a cantilever portion extending in a lateral direction from the base portion. The cantilever portion may include a parallelogram flexure coupled between the base portion and a free end of the cantilever portion.

US Patent:

61410381, Oct 31, 2000

Filed:

Jun 27, 1997

Appl. No.:

8/884466

Inventors:

Scott A. Young - Soquel CA
Roger Kroeze - Tracy CA
Curt H. Chadwick - Los Gatos CA
Nicholas Szabo - Cupertino CA
Kent E. Douglas - San Martin CA
Fred E. Babian - Boulder Creek CA

Assignee:

KLA Instruments Corporation - San Jose CA

International Classification:

H04N 718

US Classification:

348 87

Abstract:

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.