Kevin David Atkinson

US Patent:

57773548, Jul 7, 1998

Filed:

Apr 21, 1997

Appl. No.:

8/837570

Inventors:

Gary H. Cheung - Fremont CA
Elias Lozano - Sunnyvale CA
Trung Nguyen - San Jose CA
Michael J. Colwell - Livermore CA
Kevin Atkinson - Eden Prairie MN

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 27118

US Classification:

257202

Abstract:

An apparatus and method of (input/output) I/O design, utilizing a predetermined relationship, whereby the outer ring area of an integrated circuit die are set aside for the I/O circuits which are contained in I/O cells. The height of the I/O cell is first reduced from the prior art cell heights, and the width of the cell is then varied according to the particular need of the circuit. When the drive strength of the I/O circuit is high, and the circuit is more complicated, a wider cell is assigned. Conversely, for a circuit that is relatively simple, a narrower cell will be assigned. Each I/O cell has one associated bonding pad which is placed directly below the starting point of that cell. The height of the cells may also be varied on each side of the chip in order to be able to place more I/O cells along one or more sides or edges of the chip.

US Patent:

55523331, Sep 3, 1996

Filed:

Sep 16, 1994

Appl. No.:

8/307942

Inventors:

Gary H. Cheung - Fremont CA
Elias Lozano - Sunnyvale CA
Trung Nguyen - San Jose CA
Michael J. Colwell - Livermore CA
Kevin Atkinson - Eden Prairie MN

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2170

US Classification:

437 51

Abstract:

An apparatus and method of (input/output) I/O design, utilizing a predetermined relationship, whereby the outer ring area of an integrated circuit die are set aside for the I/O circuits which are contained in I/O cells. The height of the I/O cell is first reduced from the prior art cell heights, and the width of the cell is then varied according to the particular need of the circuit. When the drive strength of the I/O circuit is high, and the circuit is more complicated, a wider cell is assigned. Conversely, for a circuit that is relatively simple, a narrower cell will be assigned. Each I/O cell has one associated bonding pad which is placed directly below the starting point of that cell. The height of the cells may also be varied on each side of the chip in order to be able to place more I/O cells along one or more sides or edges of the chip.