Kevin C Chen

US Patent:

7170185, Jan 30, 2007

Filed:

Oct 17, 2000

Appl. No.:

09/690600

Inventors:

Peter B. Hogerton - White Bear Lake MN, US
Kevin Yu Chen - San Diego CA, US
Joel A. Gerber - Orono MN, US
Robert L. D. Zenner - Minneapolis MN, US

Assignee:

3M Innovative Properties Company - St. Paul MN

International Classification:

H01L 23/52
H01L 23/48
H01L 23/40
H01L 23/485
H01L 23/498

US Classification:

257780, 257778, 257738, 257E23021, 257E23069

Abstract:

The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

US Patent:

D558777, Jan 1, 2008

Filed:

Mar 6, 2007

Appl. No.:

29/277678

Inventors:

Curt Croley - Stony Brook NY, US
Quintin Morris - Brooklyn NY, US
Chris Hammond - Shoreham NY, US
Kevin Chen - Selden NY, US

Assignee:

Symbol Technologies, Inc. - Holtsville NY

International Classification:

0807

US Classification:

D14453

US Patent:

20070102827, May 10, 2007

Filed:

Jan 8, 2007

Appl. No.:

11/620813

Inventors:

Peter Hogerton - White Bear Lake MN, US
Kevin Chen - San Diego CA, US
Joel Gerber - Orono MN, US
Robert Zenner - Minneapolis MN, US

International Classification:

H01L 23/48
H01L 21/00

US Classification:

257778000, 438108000, 257E21503

Abstract:

The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

US Patent:

62460102, Jun 12, 2001

Filed:

Nov 25, 1998

Appl. No.:

9/199693

Inventors:

Robert L. D. Zenner - Minneapolis MN
Joel Arthur Gerber - St. Paul MN
Kevin Yu Chen - Eagan MN

Assignee:

3M Innovative Properties Company - St. Paul MN

International Classification:

H05K 116
H05K 114
H05K 111

US Classification:

174260

Abstract:

The present invention is an ultra-thin circuit package with a thinned electronic device having a thickness of less than about 100. mu. m; a flexible circuit substrate; and an adhesive layer with a thickness of less than about 25. mu. m between the electronic device and the circuit substrate. The circuit package is less than about 275. mu. m thick. In another embodiment, the circuit packages may be stacked on one another and laminated together to create an extremely high-density three-dimensional electronic circuit package.

US Patent:

60176563, Jan 25, 2000

Filed:

Oct 3, 1997

Appl. No.:

8/943637

Inventors:

Ann M. Crespi - Minneapolis MN
Kevin Chen - New Brighton MN

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

H01M 618

US Classification:

429307

Abstract:

An electrochemical cell containing a cathode comprising silver vanadium oxide and an anode comprising lithium is disclosed that includes an improved electrolyte composition having the solvents propylene carbonate and 1,2-dimethoxyethane, and an additional third solvent that reduces the solubility of the composition of the silver vanadium cathode material. Preferably, the third solvent is a dialkyl carbonate such as dimethyl carbonate, diethyl carbonate or ethylmethyl carbonate. The improved electrolyte composition reduces the build up of resistance in the cell during cell discharge, and may affect the cell's performance in implantable cardiac defibrillator applications. The cell of the present invention may include a hybrid cathode containing a mixture of silver vanadium oxide and carbon monofluoride (CF. sub. x).

US Patent:

57667977, Jun 16, 1998

Filed:

Nov 27, 1996

Appl. No.:

8/757220

Inventors:

Ann M. Crespi - Minneapolis MN
Kevin Chen - New Brighton MN

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

H01M 614

US Classification:

429197

Abstract:

A lithium/silver vanadium oxide cell is disclosed that includes an improved electrolyte composition having the solvents propylene carbonate and 1,2-dimethoxyethane, and an additional third solvent that reduces the solubility of the composition of the silver vanadium cathode material. Preferably, the third solvent is a dialkyl carbonate such as dimethyl carbonate, diethyl carbonate or ethylmethyl carbonate. The improved electrolyte composition reduces the build up of resistance in the cell during cell discharge, and can affect the cell's performance in implantable cardiac defibrillator applications.

US Patent:

20220348633, Nov 3, 2022

Filed:

May 3, 2022

Appl. No.:

17/735197

Inventors:

- Stony Brook NY, US
Kevin PINZ - Stony Brook NY, US
Xun JIANG - Stony Brook NY, US
Masayuki WADA - Stony Brook NY, US
Kevin CHEN - Stony Brook NY, US

International Classification:

C07K 14/705
C07K 14/54
A61K 38/20
A61K 35/17
A61P 35/00
A61P 35/02
C07K 16/28
C07K 14/725
A61K 39/395
A61K 38/17
C12N 5/0783
A61K 39/00
C07K 16/30
C12N 15/86

Abstract:

In one embodiment, the present disclosure provides an engineered cell having a first chimeric antigen receptor polypeptide including a first antigen recognition domain, a first signal peptide, a first hinge region, a first transmembrane domain, a first co-stimulatory domain, and a first signaling domain; and a second chimeric antigen receptor polypeptide including a second antigen recognition domain, a second signal peptide, a second hinge region, a second transmembrane domain, a second co-stimulatory domain, and a second signaling domain; wherein the first antigen recognition domain is different than the second antigen recognition domain.

US Patent:

20220241327, Aug 4, 2022

Filed:

Oct 15, 2021

Appl. No.:

17/502238

Inventors:

- Stony Brook NY, US
Kevin Pinz - Stony Brook NY, US
Xun Jiang - Stony Brook NY, US
Masayuki Wada - Stony Brook NY, US
Kevin Chen - Stony Brook NY, US

International Classification:

A61K 35/17
C07K 14/705
A61P 35/02
C07K 14/47
C07K 14/54

Abstract:

The present disclosure relates to compositions and methods relating to chimeric antigen receptor (CAR) polypeptides and methods relating thereto. In one embodiment, the present disclosure relates to engineered cells having chimeric antigen receptor polypeptides directed to at least two targets. In another embodiment, the present disclosure relates to engineered cells having chimeric antigen receptor polypeptides and an enhancer moiety.