Kevin Chen

US Patent:

6624945, Sep 23, 2003

Filed:

Feb 12, 2001

Appl. No.:

09/781825

Inventors:

Shanhui Fan - Palo Alto CA
John D. Joannopoulos - Belmont MA
George B. Kenney - Medfield MA
Michal Lipson - Waltham MA
Kevin M. Chen - Cambridge MA
Lionel C Kimerling - Concord MA

Assignee:

Massachusetts Institute of Technology - Cambridge MA

International Classification:

G02B 2700

US Classification:

359584, 359587, 359580, 359578, 359577

Abstract:

An electromagnetic wavelength filter that allows the transmission of electromagnetic energy within a narrow range of wavelengths while reflecting incident electromagnetic energy at other wavelengths. The filter includes at least one cavity region; and at least two reflectors surrounding the at least one cavity region, at least one of the reflectors being an omni-directional reflector. The omni-directional reflector includes a structure with a surface and an index of refraction variation perpendicular to the surface, and the omni-directional reflector is specifically configured to exhibit high omni-directional reflection for a predetermined range of frequencies of incident electromagnetic energy for any angle of incidence and any polarization.

US Patent:

6846509, Jan 25, 2005

Filed:

Nov 21, 2001

Appl. No.:

09/991438

Inventors:

Kevin M. Chen - Santa Clara CA, US
Lionel C. Kimerling - Concord MA, US

Assignee:

Massachusetts Institute of Technology - Cambridge MA

International Classification:

B05D 302
B05D 512
C23C 1400

US Classification:

427 66, 427 74, 4271263, 427166, 427380, 20419215, 20419226

Abstract:

A system for producing Erbium Oxide thin films with increased photoluminescence. The system includes a depositing stage for forming Erbium Oxide molecules by reacting Erbium sputtered atoms with Oin a gas phase and creating the Erbium Oxide thin film by depositing the Erbium Oxide molecules on a substrate coated with Silicon Oxide. The system further includes an annealing stage for annealing the Erbium Oxide thin films by utilizing a low temperature treatment for a specified amount of time and temperature followed by a high temperature treatment for another specified amount of time and temperature, wherein the crystallinity of the thin films has improved.

US Patent:

7170185, Jan 30, 2007

Filed:

Oct 17, 2000

Appl. No.:

09/690600

Inventors:

Peter B. Hogerton - White Bear Lake MN, US
Kevin Yu Chen - San Diego CA, US
Joel A. Gerber - Orono MN, US
Robert L. D. Zenner - Minneapolis MN, US

Assignee:

3M Innovative Properties Company - St. Paul MN

International Classification:

H01L 23/52
H01L 23/48
H01L 23/40
H01L 23/485
H01L 23/498

US Classification:

257780, 257778, 257738, 257E23021, 257E23069

Abstract:

The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

US Patent:

7912773, Mar 22, 2011

Filed:

Mar 26, 2007

Appl. No.:

11/691277

Inventors:

Revathi Subramanian - San Diego CA, US
Radu Drossu - San Diego CA, US
Kevin Chaowen Chen - San Diego CA, US
Paul C. Dulany - San Diego CA, US

Assignee:

SAS Institute Inc. - Cary NC

International Classification:

G06Q 40/00

US Classification:

705 35

Abstract:

Systems and methods for performing fraud detection. As an example, a system and method can be configured to contain a raw data repository for storing raw data related to financial transactions. A data store contains rules to indicate how many generations or to indicate a time period within which data items are to be stored in the raw data repository. Data items stored in the raw data repository are then accessed by a predictive model in order to perform fraud detection.

US Patent:

20060078293, Apr 13, 2006

Filed:

Feb 4, 2005

Appl. No.:

11/051415

Inventors:

Richard Wyman - Sunnyvale CA, US
Kevin (Jean-Huang) Chen - Cupertino CA, US

International Classification:

H04N 5/783

US Classification:

386068000, 386131000

Abstract:

A system and method that repeat video images in a deinterlacing system. The method comprises detecting a signal requesting an input video image be repeated and determining the desired number of repetitions. The input video image may then be processed to generate an output video image and the output video image may be repeated the desired number of repetitions. The input video images following the repeated image may be held until the repeating is completed, and may then be processed and displayed. Repeating the video image may be utilized to achieve different playback modes such as, for example, slow motion, pause, and video rate conversion.

US Patent:

20070102827, May 10, 2007

Filed:

Jan 8, 2007

Appl. No.:

11/620813

Inventors:

Peter Hogerton - White Bear Lake MN, US
Kevin Chen - San Diego CA, US
Joel Gerber - Orono MN, US
Robert Zenner - Minneapolis MN, US

International Classification:

H01L 23/48
H01L 21/00

US Classification:

257778000, 438108000, 257E21503

Abstract:

The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

US Patent:

20130339218, Dec 19, 2013

Filed:

May 30, 2013

Appl. No.:

13/905524

Inventors:

Radu Drossu - San Diego CA, US
Kevin Chaowen Chen - San Diego CA, US
Paul C. Dulany - San Diego CA, US

Assignee:

SAS Institute Inc. - Cary NC

International Classification:

G06Q 40/02

US Classification:

705 38

Abstract:

Systems and methods for performing fraud detection. As an example, a system and method can be configured to contain a raw data repository for storing raw data related to financial transactions. A data store contains rules to indicate how many generations or to indicate a time period within which data items are to be stored in the raw data repository. Data items stored in the raw data repository are then accessed by a predictive model in order to perform fraud detection.

US Patent:

20220404049, Dec 22, 2022

Filed:

Jun 17, 2021

Appl. No.:

17/350787

Inventors:

- Mountain View CA, US
Kristoffer J. Donhowe - Mountain View CA, US
Ramya Bhagavatula - Palo Alto CA, US
Jeffrey Gleeson - Danville CA, US
Kevin Chen - Menlo Park CA, US

Assignee:

Google LLC - Mountain View CA

International Classification:

F24F 11/47
F24F 11/58
F24F 11/62

Abstract:

Techniques for performing an emissions demand response event are described. In an example, a cloud-based HVAC control server system receives an emissions rate forecast for a predefined future time period. Using the emissions rate forecast, a plurality of emissions differential values are created for a plurality of points in time during the predefined future time period. The emissions differential values represent a change in predicted emissions over time. Based on the plurality of emissions differential values and a predefined maximum number of emissions demand response events, an emissions demand response event is generated during the predefined future time period. The cloud-based HVAC control server system then causes a thermostat to control an HVAC system in accordance with the generated emissions demand response event.