Kevin A Dore

US Patent:

20090155552, Jun 18, 2009

Filed:

Dec 14, 2007

Appl. No.:

11/956619

Inventors:

Edmund Blackshear - Wappingers Falls NY, US
Kevin A. Dore - Fishkill NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

B32B 3/10
B32B 37/12

US Classification:

428209, 156 60

Abstract:

An IC chip package having a glass reinforced outermost epoxy layers and related method are disclosed. In one embodiment, the IC chip package includes an IC chip; and a substrate coupled to the IC chip, the substrate including a glass fiber reinforced epoxy core, a plurality copper circuitry containing, particle reinforced epoxy layers symmetrically-oriented to each surface of the glass fiber reinforced epoxy core, and an outermost glass fiber reinforced epoxy layer on each surface of the plurality of layers, wherein the IC chip is coupled to copper circuitry bonded to one of the outermost glass fiber reinforced epoxy layer.

US Patent:

20090294971, Dec 3, 2009

Filed:

Jun 2, 2008

Appl. No.:

12/131298

Inventors:

Edmund D. BLACKSHEAR - Wappingers Falls NY, US
David J. RUSSELL - Owego NY, US
Kevin A. DORE - Wappingers Falls NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H01L 23/488
H01L 21/44

US Classification:

257762, 438612, 257E23023, 257E21476

Abstract:

A structure comprises: a substrate; at least one conductor on the substrate; at least one contact pad on the substrate; a mask over the conductor (wherein the mask comprises an opening over the contact pad and wherein the mask comprises a bottom surface contacting the substrate and a top surface opposite the bottom surface); and a contact pad plating layer on the contact pad and within the opening of the mask. The contact pad plating layer comprises a bottom surface contacting the contact pad and a top surface opposite the bottom surface, and the top surface of the contact pad plating layer is coplanar with the top surface of the mask.

US Patent:

62912674, Sep 18, 2001

Filed:

Oct 15, 1999

Appl. No.:

9/418940

Inventors:

Kevin A. Dore - Fishkill NY
David L. Edwards - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144
H01L 2148
H01L 2158

US Classification:

438108

Abstract:

A process for underfilling a chip-under-chip module. The module comprises a first larger chip, a second smaller chip attached to the underside of the first chip, a substrate having a top surface to which the first chip is mounted, a cavity into which the second chip fits when the first chip is mounted on the top surface, and an access channel connecting the cavity to the top surface. Underfill is disposed under the first chip between the first chip and the substrate, between the first and second chips, within the cavity, and within the access channel. The process for underfilling such a module comprises the steps of forming the substrate having the cavity and access channel in the substrate, connecting the first chip to the substrate, and dispensing underfill through the access channel.

US Patent:

62394843, May 29, 2001

Filed:

Jun 9, 1999

Appl. No.:

9/328962

Inventors:

Kevin A. Dore - Fishkill NY
David L. Edwards - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348
H01L 2352
H01L 2940

US Classification:

257687

Abstract:

A chip-under-chip module and a substrate for making the module. The module comprises a first larger chip, a second smaller chip attached to the underside of the first chip, a substrate having a top surface to which the first chip is mounted, a cavity into which the second chip fits when the first chip is mounted on the top surface, and an access channel connecting the cavity to the top surface. Underfill is disposed under the first chip between the first chip and the substrate, between the first and second chips, within the cavity, and within the access channel. A process for manufacture of such a module comprises the steps of forming the substrate having the cavity and access channel in the substrate, connecting the first chip to the substrate, and dispensing underfill through the access channel.