Amkor Technology
Corporate Vice President Flipchip and Wafer Services Business Unit
Nanium S.a
Member of the Board of Advisors
Amkor Technology Taiwan 2010 - 2012
Vice President
Unitive Advanced Semicondutor Packaging 1998 - 2004
Application Engineering Manager
Microelectronics Center of North Carolina Jan 1997 - Jan 1998
Wet Sector Engineer
Education:
Auburn University 1994
Bachelors, Chemical Engineering
Auburn University 1990 - 1994
Stanford University Graduate School of Business
Skills:
Leadership Strategy Product Management Cross Functional Team Leadership Semiconductors
J. Daniel Mis - Cary NC, US Kevin Engel - Durham NC, US
Assignee:
Unitive International Limited - Curacao
International Classification:
B23K 31/00
US Classification:
2281805, 22818022
Abstract:
Metallurgy structures for input/output pads of an electronic devices can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, and a wire bond can be applied to the second metallurgy structure.
Methods Of Forming Back Side Layers For Thinned Wafers
Glenn A. Rinne - Apex NC, US Kevin Engel - Gilbert AZ, US Julia Roe - Hillsborough NC, US Chirstopher John Berry - Chandler AZ, US
Assignee:
Amkor Technology, Inc. - Chandler AZ
International Classification:
H01L 21/44
US Classification:
438457, 438458, 438459
Abstract:
A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed.
Wafers Including Patterned Back Side Layers Thereon
Glenn A. Rinne - Apex NC, US Kevin Engel - Gilbert AZ, US Julia Roe - Hillsborough NC, US Christopher John Berry - Chandler AZ, US
Assignee:
Amkor Technology, Inc. - Chandler AZ
International Classification:
H01L 23/498
US Classification:
257734, 438460, 438462, 438464, 438465
Abstract:
A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed.
Methods Of Forming Metallurgy Structures For Wire And Solder Bonding
Metallurgy structures for input/output pads of an electronic devices can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, and a wire bond can be applied to the second metallurgy structure.
Name / Title
Company / Classification
Phones & Addresses
Kevin Engel President
Red Deer Lock & Safe Ltd Locks & Locksmiths. Security Control Equipment & System Monitors. Safes & Vaults
1-6264 67A St, Red Deer, AB T4P 3E8 4033431391, 4033461085
Kevin Engel President
Red Deer Lock & Safe Ltd Locks & Locksmiths · Security Control Equipment & System Monitors · Safes & Vaults
Kevin Engel (1975-1979), Jaimie Houser (1993-1997), Phil Wright (1970-1974), Kurtis Hinz (1992-1996), Callum Russell (1987-1991), Jacquie Kussat (1983-1987)
Hi, my name is Kev. I was born and raised in Nampa, Id. I went to Nampa Senior High School. Now pretty much just trying to start my own life, and having troubles. Want to know more, just message me.
ticipant Andre Dirrell, will headline ESPN2/ESPN3's "Friday Night Fights" at Morongo Casino Resort in Cabazon, Calif., on July 22. Dirrell will face Kevin Engel (18-4, 15 KOs) in a scheduled 10-rounder. Engel took the fight after former titleholder Alejandro Berrio dropped out due to a visa issue. In