Kevin A Hanson

US Patent:

6657297, Dec 2, 2003

Filed:

Aug 15, 2002

Appl. No.:

10/219210

Inventors:

Radesh Jewram - Lakeville MN
Kasyap Venkata Seethamraju - Woodbury MN
Kevin L. Hanson - Bloomington MN

Assignee:

The Bergquist Company - Chanhassen MN

International Classification:

H01L 2334

US Classification:

257720, 257684, 257712, 428620

Abstract:

A flexible plastic thermally conductive multilayer semiconductor mounting pad having a highly thermally conductive bulk layer with thermally conductive surface skin layers bonded integrally to opposed major surfaces thereof. The bulk layer and the surface skin layers are each filled with a finely divided thermally conductive particulate, with the skin layers being harder than the bulk layer and being blended with an amount of filler which is less than that present in the bulk layer.

US Patent:

20120131102, May 24, 2012

Filed:

Aug 18, 2011

Appl. No.:

13/212848

Inventors:

John S. Gabos - Wayzata MN, US
Christine A. Gabos - Wayzata MN, US
Kevin C. Hanson - Wayzata MN, US
Jayson Go - Commerce City CO, US

International Classification:

G06F 15/16

US Classification:

709204

Abstract:

A method of distributing at least one digital file to a group. The group includes multiple group members and is managed by a managing user. The method includes: generating an album for the managing user, the album including at least one digital file by operation of a processor invoking space on an attached non-volatile memory; receiving, from the managing user, data related to the multiple group members; generating, based on the data related to the multiple group members, a copy of the album for each of the group members, thereby creating a virtual album for each of the group members; and linking the copy of the album created for each of the group members to each group member.

US Patent:

59500662, Sep 7, 1999

Filed:

Jun 14, 1996

Appl. No.:

8/663800

Inventors:

Kevin L. Hanson - Bloomington MN
Mark Green - Eden Prairie MN

Assignee:

The Bergquist Company - Edina MN

International Classification:

H01B 302
H01B 346

US Classification:

428551

Abstract:

An interface material for use in forming a coating interposed along a heat dissipating path between a solid state electronic device and a heat sinking surface. The coating consists of a formulation of a thermally stable wax which is formed as a polyorganosiloxane graft polymer of octadecene and a methylsiloxane host blended with a thermally conductive viscosity stabilizer consisting of a thermally conductive particulate material such as alumina, boron nitride, among others. The graft polymer, with its molecular weight of between approximately 10,000 and 15,000 has a density of between about 0. 8 and 0. 9 with a melting point of between about 30 degrees C. and 90 degrees C.