Kevin Y Lin

US Patent:

8187795, May 29, 2012

Filed:

Dec 9, 2008

Appl. No.:

12/331131

Inventors:

Kanti Jain - Urbana IL, US
Kevin Lin - Urbana IL, US

Assignee:

The Board of Trustees of the University of Illinois - Urbana IL

International Classification:

G03F 7/00
G03F 7/20
G01B 7/16
G01P 15/125

US Classification:

430311, 430315, 430318, 430319, 430328, 430329, 257E23117, 7351432, 73780

Abstract:

Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods utilized herein allow for efficient manufacture of large area (e. g. , up to 1 mmor greater or 1 mor greater) stretchable and/or flexible electronic devices, for example manufacturing methods permitting a reduced number of steps. The techniques described herein further provide for improved heterogeneous integration of components within an electronic device, for example components having improved alignment and/or relative positioning within an electronic device. Also described herein are flexible and/or stretchable electronic devices, such as interconnects, sensors and actuators.

US Patent:

8610986, Dec 17, 2013

Filed:

Apr 6, 2009

Appl. No.:

12/419210

Inventors:

Kanti Jain - Urbana IL, US
Junghun Chae - Champaign IL, US
Kevin Lin - Urbana IL, US
Hyunjong Jin - Urbana IL, US

Assignee:

The Board of Trustees of the University of Illinois - Urbana IL

International Classification:

G02B 26/08
G02B 26/10
G02B 26/12

US Classification:

3592241, 359904

Abstract:

Micromirrors and micromirror arrays described herein are useful, for example in maskless photolithography systems and methods and projection display devices and methods. According to one aspect, the micromirrors comprise a polymer structural layer and a reflective dielectric multilayer for selective reflection and/or redirection of incoming electromagnetic radiation. According to another aspect, incorporation of a reflective dielectric multilayer allows for use of polymer structural materials in micromirrors and prevents damage to such polymer materials due to excessive heating from absorption of electromagnetic radiation, as the reflective dielectric multilayers are highly reflective and minimize heating of the micromirror components. According to yet a further aspect, top down fabrication methods are described herein for making a micromirror comprising a polymer structural layer and a reflective dielectric multilayer.

US Patent:

8633551, Jan 21, 2014

Filed:

Jun 29, 2012

Appl. No.:

13/537573

Inventors:

Weng Hong Teh - Phoenix AZ, US
Kevin L. Lin - Beaverton OR, US
Feras Eid - Chandler AZ, US
Qing Ma - Saratoga CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 27/14

US Classification:

257414, 257686, 257E25001

Abstract:

A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.

US Patent:

20190103345, Apr 4, 2019

Filed:

Sep 29, 2017

Appl. No.:

15/721707

Inventors:

- Santa Clara CA, US
Venkata Suresh R. GUTHIKONDA - Chandler AZ, US
Patrick NARDI - Scottsdale AZ, US
Santosh SANKARASUBRAMANIAN - Chandler AZ, US
Kevin Y. LIN - Chandler AZ, US
Leigh M. TRIBOLET - Chandler AZ, US
John L. HARPER - Chandler AZ, US
Pramod MALATKAR - Chandler AZ, US

International Classification:

H01L 23/498
H01L 23/367
H01L 21/50
H01L 23/52
H01L 23/00
H05K 1/02

Abstract:

An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.

US Patent:

20180258416, Sep 13, 2018

Filed:

Mar 8, 2018

Appl. No.:

15/915909

Inventors:

- Scottsdale AZ, US
Kevin Lin - Gilbert AZ, US
Taraka Sai Pavan Grandhi - Tempe AZ, US

International Classification:

C12N 15/10
B01J 20/291
B01D 15/38

Abstract:

Ligands and methods for selectively binding hypermethylated DNA from a sample. The ligands include a CG-region binding molecule-conjugated resin derived from the aminoglycoside antibiotic amikacin. Furthermore, the CG-region binding molecule may be conjugated to the resin with a crosslinker and/or may be modified with one or more of long chain and short chain alkyl, aryl, piperazinyl, piperidyl, and pyrrolidyl groups. Such ligands are used in methods for contacting a sample to thereby selectively bind hypermethylated DNA.

US Patent:

20150179150, Jun 25, 2015

Filed:

Dec 23, 2013

Appl. No.:

14/139536

Inventors:

Nathan R. Andrysco - Chandler AZ, US
Kevin L. Lin - Chandler AZ, US

International Classification:

G09G 5/391
G06F 3/00

Abstract:

Techniques are disclosed for improving energy efficiency of displays, and in particular, displays capable of selective refresh. In an embodiment, the techniques include adjusting the effective resolution of a display based on the viewer's distance from the display. The effective resolution adjustment can be accomplished by, for example, grouping individual pixels or blurring the display buffer (or both pixel grouping and blurring) based on the viewer's distance from the display. Such an adjustment has the effect of creating enlarged pixels from a plurality of smaller pixels. In any such cases, each of the enlarged pixels (also called macro-pixels) can then be selectively refreshed based on changes from the previous frame. In addition, even if one of the macro-pixels has changed from the last frame, it also need not be refreshed if the viewer would not perceive that change given a subtle or otherwise unperceivable difference in intensity.

US Patent:

20150091890, Apr 2, 2015

Filed:

Sep 27, 2013

Appl. No.:

14/040101

Inventors:

Nathan R. Andrysco - Chandler AZ, US
Kevin L. Lin - Chandler AZ, US

International Classification:

G06T 15/04

US Classification:

345419

Abstract:

Rendering techniques are disclosed for displays capable of adjusting/changing the angle of individual pixels (or pixel groups), referred to herein as textured displays. The textured displays may be capable of creating on demand textures which may be used to simulate the surface of an object in a scene. The rendering techniques may be used to improve upon the realism of rendered scenes/objects and they may provide users with a unique rendering experience whereby the textured display physically changes to mimic textures of the rendered scenes/objects. This can be achieved by sending geometric data, such as surface normal information, to individual pixels of the textured display. Other factors may be considered when adjusting the angle of individual pixels of the textured display, such as whether the user is experiencing too much glare.

US Patent:

20150001724, Jan 1, 2015

Filed:

Jun 28, 2013

Appl. No.:

13/931219

Inventors:

Manish CHANDHOK - Beaverton OR, US
Hui Jae Yoo - Hillsboro OR, US
Yan A. Borodovsky - Portland OR, US
Florian Gstrein - Portland OR, US
David N. Shykind - Buxton OR, US
Kevin L. Lin - Chandler AZ, US

International Classification:

H01L 23/535
H01L 21/768

US Classification:

257754, 438637

Abstract:

A method including patterning a thickness dimension of an interconnect material into a thickness dimension for a wiring line with one or more vias extending from the wiring line and introducing a dielectric material on the interconnect material. A method including depositing and patterning an interconnect material into a wiring line and one or more vias; and introducing a dielectric material on the interconnect material such that the one or more vias are exposed through the dielectric material. An apparatus including a first interconnect layer in a first plane and a second interconnect in a second plane on a substrate; and a dielectric layer separating the first and second interconnect layers, wherein the first interconnect layer comprises a monolith including a wiring line and at least one via, the at least one via extending from the wiring line to a wiring line of the second interconnect layer.