Kevin S Lin

US Patent:

8633551, Jan 21, 2014

Filed:

Jun 29, 2012

Appl. No.:

13/537573

Inventors:

Weng Hong Teh - Phoenix AZ, US
Kevin L. Lin - Beaverton OR, US
Feras Eid - Chandler AZ, US
Qing Ma - Saratoga CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 27/14

US Classification:

257414, 257686, 257E25001

Abstract:

A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.

US Patent:

20190103345, Apr 4, 2019

Filed:

Sep 29, 2017

Appl. No.:

15/721707

Inventors:

- Santa Clara CA, US
Venkata Suresh R. GUTHIKONDA - Chandler AZ, US
Patrick NARDI - Scottsdale AZ, US
Santosh SANKARASUBRAMANIAN - Chandler AZ, US
Kevin Y. LIN - Chandler AZ, US
Leigh M. TRIBOLET - Chandler AZ, US
John L. HARPER - Chandler AZ, US
Pramod MALATKAR - Chandler AZ, US

International Classification:

H01L 23/498
H01L 23/367
H01L 21/50
H01L 23/52
H01L 23/00
H05K 1/02

Abstract:

An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.

US Patent:

20180258416, Sep 13, 2018

Filed:

Mar 8, 2018

Appl. No.:

15/915909

Inventors:

- Scottsdale AZ, US
Kevin Lin - Gilbert AZ, US
Taraka Sai Pavan Grandhi - Tempe AZ, US

International Classification:

C12N 15/10
B01J 20/291
B01D 15/38

Abstract:

Ligands and methods for selectively binding hypermethylated DNA from a sample. The ligands include a CG-region binding molecule-conjugated resin derived from the aminoglycoside antibiotic amikacin. Furthermore, the CG-region binding molecule may be conjugated to the resin with a crosslinker and/or may be modified with one or more of long chain and short chain alkyl, aryl, piperazinyl, piperidyl, and pyrrolidyl groups. Such ligands are used in methods for contacting a sample to thereby selectively bind hypermethylated DNA.

US Patent:

20150179150, Jun 25, 2015

Filed:

Dec 23, 2013

Appl. No.:

14/139536

Inventors:

Nathan R. Andrysco - Chandler AZ, US
Kevin L. Lin - Chandler AZ, US

International Classification:

G09G 5/391
G06F 3/00

Abstract:

Techniques are disclosed for improving energy efficiency of displays, and in particular, displays capable of selective refresh. In an embodiment, the techniques include adjusting the effective resolution of a display based on the viewer's distance from the display. The effective resolution adjustment can be accomplished by, for example, grouping individual pixels or blurring the display buffer (or both pixel grouping and blurring) based on the viewer's distance from the display. Such an adjustment has the effect of creating enlarged pixels from a plurality of smaller pixels. In any such cases, each of the enlarged pixels (also called macro-pixels) can then be selectively refreshed based on changes from the previous frame. In addition, even if one of the macro-pixels has changed from the last frame, it also need not be refreshed if the viewer would not perceive that change given a subtle or otherwise unperceivable difference in intensity.

US Patent:

20150091890, Apr 2, 2015

Filed:

Sep 27, 2013

Appl. No.:

14/040101

Inventors:

Nathan R. Andrysco - Chandler AZ, US
Kevin L. Lin - Chandler AZ, US

International Classification:

G06T 15/04

US Classification:

345419

Abstract:

Rendering techniques are disclosed for displays capable of adjusting/changing the angle of individual pixels (or pixel groups), referred to herein as textured displays. The textured displays may be capable of creating on demand textures which may be used to simulate the surface of an object in a scene. The rendering techniques may be used to improve upon the realism of rendered scenes/objects and they may provide users with a unique rendering experience whereby the textured display physically changes to mimic textures of the rendered scenes/objects. This can be achieved by sending geometric data, such as surface normal information, to individual pixels of the textured display. Other factors may be considered when adjusting the angle of individual pixels of the textured display, such as whether the user is experiencing too much glare.

US Patent:

20140182377, Jul 3, 2014

Filed:

Dec 28, 2012

Appl. No.:

13/730634

Inventors:

Kevin L. Lin - Chandler AZ, US
Faras Eid - Chandler AZ, US
Qing Ma - Saratoga CA, US

International Classification:

G01P 15/10
B81C 1/00
B81B 3/00

US Classification:

7351429, 257415, 438 50

Abstract:

Techniques and mechanisms to provide for metering acceleration. In an embodiment, a microelectromechanical accelerometer includes a magnet, a mass, and a first support beam portion and second support beam portion for suspension of the mass. Resonance frequency characteristics of the first support beam portion and second support beam portion, based on the magnet and a current conducted by the first support beam portion and second support beam portion, are indicative of acceleration of the mass. In another embodiment, the accelerometer further includes a first wire portion and a second wire portion which are each coupled to the mass and further coupled to a respective anchor for exchanging a signal with the first wire portion and the second wire portion. The first wire portion and the second wire portion provide for biasing of the mass.

US Patent:

20140083858, Mar 27, 2014

Filed:

Sep 21, 2012

Appl. No.:

13/624288

Inventors:

Weng Hong Teh - Phoenix AZ, US
Kevin Lin - Beaverton OR, US
Feras Eid - Chandler AZ, US
Qing Ma - Saratoga CA, US

International Classification:

B01D 43/00
H05K 3/30

US Classification:

204601, 29832

Abstract:

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.