Kevin John Mccullough

US Patent:

59457368, Aug 31, 1999

Filed:

Sep 28, 1998

Appl. No.:

9/163035

Inventors:

William B. Rife - Greenville RI
Kevin A. McCullough - North Kingstown RI

Assignee:

Chip Coolers, Inc. - Warwick RI

International Classification:

H01L 2340
H01L 2328
H01L 2342

US Classification:

257719

Abstract:

A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region, is provided. A top cover member is provided with a central female-threaded bore. The top member is secured, without the use of tools, to the ceramic portion of the semiconductor package by a pair of upwardly standing legs with inwardly turned flanges where the flanges engage the marginal opposing portions of the top member. A heat dissipating member, having male-threaded base, is threadably inserted into the female-threaded bore to engage the upper surface of the silicon portion of the semiconductor package. The pressure of the heat dissipating member is independently adjustable, by hand, relative to the preset pressure of the top member onto the ceramic portion of the semiconductor package. As a result, the multiple pressure requirements of the semiconductor package can be accommodated in a single heat dissipating device without the need for tools.