E. Mikhail Sagal - Watertown MA Kevin A. McCullough - Warwick RI James D. Miller - Marietta GA
Assignee:
Cool Options, Inc. - Warwick RI
International Classification:
F28F 700
US Classification:
165185, 16510426, 29890032, 361700, 257715
Abstract:
The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
Method Of Manufacturing A Composite Overmolded Heat Pipe
E. Mikhail Sagal - Watertown MA Kevin A. McCullough - Warwick RI James D. Miller - Marietta GA
Assignee:
Cool Options, Inc. - Warwick RI
International Classification:
B23P 1500
US Classification:
29890032, 2989003, 295271
Abstract:
The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
Polymer Electronic Device Package Having High Thermal Conductivity And Dielectric Strength
E. Mikhail Sagal - Watertown MA, US Kevin A. McCullough - Warwick RI, US James D. Miller - Marietta GA, US
Assignee:
Cool Options, Inc. - Warwick RI
International Classification:
C08K 3/10 C08K 3/40 H01L 23/29
US Classification:
524404, 524430, 524494, 257789
Abstract:
A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.
Polymer Compositions Having High Thermal Conductivity And Dielectric Strength And Molded Packaging Assemblies Produced Therefrom
A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.
Method Of Forming An Electronic Device Having High Thermal Conductivity And Dielectric Strength
E. Mikhail Sagal - Watertown MA, US Kevin McCullough - Warwick RI, US James Miller - Marietta GA, US
International Classification:
H01B001/00
US Classification:
252500000
Abstract:
A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.