Kevin B Mccullough

age ~44

from Boston, MA

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Also known as:

Kevin Mc Cullough

Connected to:

Kevin Mccullough Phones & Addresses

Boston, MA
Philadelphia, PA
24 Verona Rd, Marlton, NJ 08053 • 8565965819
191 Cedartown Rd, Hartwell, GA 30643 • 7063772059
Sylmar, CA
South Bend, IN
Glassboro, NJ

Work

Company:

Mazow McCullough PC
Address:

85 Exchange Street Suite 310, Lynn, MA 01901
Specialities:

Personal Injury - 75% • Criminal Defense - 25%

Education

Degree:

JD - Juris Doctor
School / High School:

New England School of Law

Ranks

Licence:

Massachusetts - Active
Date:

1999

Specialities

Buyer's Agent • Listing Agent

Resumes

Kevin Mccullough Coatesville, PA

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Work:

Robert Half Office Team

Jan 2014 to 2000
Customer Service Representative Force One Merchandising
May 2011 to Dec 2013 Diamond Edge Communication
Exton, PA
Nov 2011 to Feb 2012
General Merchandiser Diamond Edge Communication
Philadelphia, PA
Aug 2011 to Feb 2012
Copywriter Wegmans Grocery Store

Mar 2005 to Jun 2011
Front End Employee

Education:

Temple University
Feb 2012
Bachelor of Communications in Advertising

Kevin Mccullough Bensalem, PA

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Work:

Pathfinders Staffing Agency
Yardley, PA
Jun 2013 to Aug 2013
Data Processor for Data Entry for Medimedia Coworx Staffing Agency
Yardley, PA
Jan 2013 to Apr 2013
Customer Service Rep/Pharmaceutical Representative for Sunovion Phamaceuticals and Publicis Touchpoint Solutions Aerotek Staffing Agency
Hatboro, PA
Jun 2012 to Jul 2012
Customer Service Representative for Asset Management Specialists/AMS Adecco Staffing Employment Agency
Oxford Valley, PA
Jan 2007 to Oct 2010
Customer Service Representative for Educational Testing Service/ETS American Staffing Agency
Feasterville-Trevose, PA
Jun 2006 to Jan 2007
Customer Service Representative for Educational Testing Service/ETS PNC Bank

Sep 2005 to Jan 2006
Switcher/bank teller Bally Total Fitness
Philadelphia, PA
Mar 2004 to Feb 2005
Marketing Yardley Inn

Jan 2001 to Aug 2001
Barback/Bartender

Education:

Bucks County Community College http://www.bucks.edu/
Newtown, PA
2000 to 2001
Business Administration Archbishop Wood High School http://www.archwood.org/
Warminster, PA
1996 to 2000
General Studies/Business

Skills:

Banking, payroll, can use a 10-key calculator, office equipment

Lawyers & Attorneys

Kevin John McCullough, Lynn MA - Lawyer

view source

Address:

Mazow McCullough PC
85 Exchange Street Suite 310, Lynn, MA 01901
9787448000 (Office), 9787448012 (Fax)

Licenses:

Massachusetts - Active 1999

Education:

New England School of Law
Degree - JD - Juris Doctor - Law
Plymouth State College
Degree - BS - Bachelor of Science - Business Management

Specialties:

Personal Injury - 75%
Criminal Defense - 25%

Isbn (Books And Publications)

Musclehead Revolution

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Author
Kevin Mccullough

ISBN #
0736917306

Name / Title

Company / Classification

Phones & Addresses

Kevin McCullough

J & M Meats International Ltd
Meat - Retail

5717 50 St, Warburg, AB T0C 2T0
7808487598

Kevin Mccullough
President

Mazow & McCullough, PC
Legal Services

10 Derby Square, 4, Salem, MA 01970
85 Exchange St, Lynn, MA 01901

Kevin J. Mccullough
Manager

LAW OFFICES OF PIP COLLECT, LLC
Legal Services Office

2 Salem Grn, Salem, MA 01970
10 Derby Sq, Salem, MA 01970
9787457950

Kevin Mccullough

J & M Meats International Ltd
Meat - Retail

7808487598

Kevin Mccullough
Information Systems Analys

Lockheed Martin Corporation
Provides Engineering & Management Services

2000 Midlantic Dr, Mount Laurel, NJ 08054
8567275843

Kevin Mccullough

MAC PRO PAINTING, INC

Us Patents

Composite Overmolded Heat Pipe Construction
view source
US Patent:

6585039, Jul 1, 2003
Filed:

Jan 31, 2001
Appl. No.:

09/774519
Inventors:

E. Mikhail Sagal - Watertown MA
Kevin A. McCullough - Warwick RI
James D. Miller - Marietta GA
Assignee:

Cool Options, Inc. - Warwick RI
International Classification:

F28F 700
US Classification:

165185, 16510426, 29890032, 361700, 257715
Abstract:

The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.

Method Of Manufacturing A Composite Overmolded Heat Pipe
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US Patent:

6681487, Jan 27, 2004
Filed:

Apr 16, 2002
Appl. No.:

10/123363
Inventors:

E. Mikhail Sagal - Watertown MA
Kevin A. McCullough - Warwick RI
James D. Miller - Marietta GA
Assignee:

Cool Options, Inc. - Warwick RI
International Classification:

B23P 1500
US Classification:

29890032, 2989003, 295271
Abstract:

The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.

Polymer Electronic Device Package Having High Thermal Conductivity And Dielectric Strength
view source
US Patent:

7476702, Jan 13, 2009
Filed:

Apr 29, 2005
Appl. No.:

11/118057
Inventors:

E. Mikhail Sagal - Watertown MA, US
Kevin A. McCullough - Warwick RI, US
James D. Miller - Marietta GA, US
Assignee:

Cool Options, Inc. - Warwick RI
International Classification:

C08K 3/10
C08K 3/40
H01L 23/29
US Classification:

524404, 524430, 524494, 257789
Abstract:

A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.

Polymer Compositions Having High Thermal Conductivity And Dielectric Strength And Molded Packaging Assemblies Produced Therefrom
view source
US Patent:

20030139510, Jul 24, 2003
Filed:

Nov 13, 2002
Appl. No.:

10/292970
Inventors:

E. Sagal - Watertown MA, US
Kevin McCullough - Warwick RI, US
James Miller - Mrietta GA, US
International Classification:

C08K003/38
C08K003/18
C08K003/22
C08K003/34
C08K003/40
US Classification:

524/404000, 524/433000, 524/492000, 524/494000
Abstract:

A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.

Method Of Forming An Electronic Device Having High Thermal Conductivity And Dielectric Strength
view source
US Patent:

20050189522, Sep 1, 2005
Filed:

Apr 29, 2005
Appl. No.:

11/118056
Inventors:

E. Mikhail Sagal - Watertown MA, US
Kevin McCullough - Warwick RI, US
James Miller - Marietta GA, US
International Classification:

H01B001/00
US Classification:

252500000
Abstract:

A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.