Kevin Michael Mccullough

US Patent:

6385047, May 7, 2002

Filed:

Oct 19, 2000

Appl. No.:

09/692555

Inventors:

Kevin A. McCullough - Warwick RI
E. Mikhail Sagal - Watertown MA

Assignee:

Cool Shield, Inc. - Warwick RI

International Classification:

H05G 720

US Classification:

361704, 361706, 361709, 361710, 257706, 257722, 174 163, 165 803, 165185

Abstract:

A net-shape moldable U-shaped heat sink assembly formed by injection molding of a thermally conductive polymer composite material is shown. The heat sink assembly includes a base member with a number of integrated fins members thereon. A right upstanding wall extends from a first side of the base member and a left upstanding wall extends from a second side of the base member to form a substantially U-shaped heat sink assembly. To enhance thermal conductivity, fins members may be integrally formed into the base member, right wall and/or left wall during the molding of the heat sink assembly. Also, a flexible metallic substrate or hinges may be embedded within the U-shaped heat sink assembly to permit positioning of the right wall and left wall relative to the base member for custom configuration of the heat sink assembly.

US Patent:

6397941, Jun 4, 2002

Filed:

Nov 7, 2000

Appl. No.:

09/707778

Inventors:

Kevin A. McCullough - Warwick RI

Assignee:

Cool Options, Inc. - Warwick RI

International Classification:

F28F 700

US Classification:

165185, 165 803, 16510433, 361697, 361700, 257715, 257722

Abstract:

A net-shape molded heat exchanger is provided which includes a thermally conductive main body and a number of thermally conductive arms connected to and extending from the main body. A number of thermally conductive fins are connected to the arms. The heat exchanger is formed by net-shape molding a main body, the arms which emanate from the main body and the fins from a thermally conductive composition, such as a polymer composition. The molded heat exchanger is freely convecting through the part which makes it more efficient and has an optimal thermal configuration. Optionally, heat pipes may be embedded within the arms of the heat exchanger to further enhance heat dissipation.

US Patent:

6407149, Jun 18, 2002

Filed:

Nov 29, 2000

Appl. No.:

09/726145

Inventors:

Kevin A. McCullough - Warwick RI

Assignee:

Cool Options, Inc. - Warwick RI

International Classification:

C08K 900

US Classification:

523205, 523215, 523351, 524439, 524441, 524495, 25229901, 26433111

Abstract:

A method of molding an evenly colored, thermally conductive composition. Thermally conductive filler material is colored and mixed with a base polymer matrix. The mixture is molded into the desired shape. The step of for coloring the filler material is tailored to the type of thermally conductive filler used and could include, as required, anodizing, spraying or dying of the material before mixing with the base polymer matrix and prior to molding.

US Patent:

6478997, Nov 12, 2002

Filed:

Nov 29, 2000

Appl. No.:

09/726140

Inventors:

Kevin A. McCullough - Warwick RI

Assignee:

Cool Options, Inc. - Warwick RI

International Classification:

B29C 4700

US Classification:

264108, 26417126, 26417715, 2642091, 26432816, 428 357, 16510426

Abstract:

A polymer heat pipe with a carbon core and a method of forming such a heat pipe is disclosed. The heat pipe includes a substantially pure carbon fiber core and an outer jacket of substantially pure polymer material. The heat pipe is formed by extruding a mixture of a base of polymer material and a plurality of carbon fibers through an extrusion die. The extrusion die is heated into a range of approximately 250-400Â F. to cause the carbon fiber to migrate to the center of the extrudate and the polymer to migrate outwardly. As a result, a jacket of polymer material is formed around a core of carbon fibers to form a highly thermally conductive heat pipe.

US Patent:

6487073, Nov 26, 2002

Filed:

Nov 29, 2000

Appl. No.:

09/726141

Inventors:

Kevin A. McCullough - Warwick RI
E. Mikhail Sagal - Watertown MA
James D. Miller - Marietta GA

Assignee:

Cool Options, Inc. - Warwick RI

International Classification:

G06F 120

US Classification:

361687, 361688, 361709, 361712

Abstract:

A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.

US Patent:

6503964, Jan 7, 2003

Filed:

Jan 10, 2001

Appl. No.:

09/757499

Inventors:

Lyle James Smith - Providence RI
Mikhail Sagal - Watertown MA
James D. Miller - Marietta GA
Kevin A. McCullough - Warwick RI

Assignee:

Cool Options, Inc. - Warwick RI

International Classification:

G21K 112

US Classification:

523137, 523215, 524495, 427217, 428403, 428570

Abstract:

A thermally conductive and electromagnetic interference and radio frequency reflective polymer composition and a method for creating the same is disclosed. Thermally conductive filler material is coated with a thermally conductive and electromagnetic interference and radio frequency reflective coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electromagnetic interference and radio frequency reflective coating material prevents the absorption and transfer of EMI and RF waves through the filler material thus resulting in an EMI and RF reflective composition.

US Patent:

6540948, Apr 1, 2003

Filed:

Jan 10, 2001

Appl. No.:

09/757744

Inventors:

Kevin A. McCullough - Warwick RI

Assignee:

Cool Options, Inc. - Warwick RI

International Classification:

B29C 3310

US Classification:

264105, 2642711, 264275, 264277, 425123, 425812

Abstract:

A method of overmolding a heat pipe includes providing an injection mold apparatus having a cavity, an input gate, a bleed off overflow gate in communication with the cavity and a tubular heat pipe charged with phase change media which is capable of being collapsed by imparting an external collapsing pressure. The tubular heat pipe is placed into the cavity in the injection mold apparatus. A net shape moldable thermally conductive material is introduced into the cavity and around the tubular pipe. The bleed off overflow gate is set to open at a predetermined pressure which less than the external collapsing pressure which would damage the heat pipe to be overmolded. Pressure is relieved in the cavity of the mold apparatus through the bleed off overflow gate when pressure in the bleed off overflow gate reaches the predetermined pressure. As a result, delicate heat pipes can be overmolded in an injection mold apparatus without damage to the heat pipe during the molding process.

US Patent:

6543524, Apr 8, 2003

Filed:

Jun 21, 2001

Appl. No.:

09/886629

Inventors:

Kevin A. McCullough - Warwick RI
E. Mikhail Sagal - Watertown MA
James D. Miller - Marietta GA

Assignee:

Cool Options, Inc. - Warwick RI

International Classification:

F28F 1318

US Classification:

165133, 165185, 165905, 257746

Abstract:

A net-shape molded heat transfer component is provided which includes a thermally conductive core and a metallic coating for reflection of electromagnetic interference and radio frequency waves. The heat transfer component is formed by net-shape molding a core body from a thermally conductive composition, such as a polymer composition, and applying a metallic coating. The molded heat transfer part is freely convecting through the part, which makes it more efficient and has an optimal thermal configuration. Additionally, the part is shielded from electromagnetic interference and radio frequency waves, thus preventing the transfer of same into the circuitry housed by the part. In addition, the coating also seals the conductive polymer core against moisture infiltration, making the part well suited for telecommunications applications in potentially harsh environments.