Kevin Haidu Nguyen

US Patent:

20180029877, Feb 1, 2018

Filed:

Jul 26, 2016

Appl. No.:

15/220048

Inventors:

- San Jose CA, US
Tom Nguyen - San Jose CA, US
Kevin Cuong Nguyen - San Jose CA, US
Claudio Martinez - Deer Park WA, US

International Classification:

B81B 7/00
B81C 1/00

Abstract:

Sensor packages and methods of assembling a sensor in a sensor package are provided. A preferred embodiment comprises: a base including a sensor coupled to the base wherein the base has at least one electrical connection location and a first mechanical mating interface in the shape of an arc; an electronics package with at least one electrical connection location; and a ring coupled between the base and the electronics package wherein the ring electrically connects the at least one electrical connection location on the base and the at least one electrical connection location on the electronics package and wherein the base has a second mechanical mating interface in the shape of an arc that is reciprocal to the first mating interface.