Kevin J O'Connor

US Patent:

7992294, Aug 9, 2011

Filed:

May 23, 2008

Appl. No.:

12/126635

Inventors:

Victor Zaderej - St. Charles IL, US
Kevin O'Connor - Lisle IL, US
Charlie Manlapaz - Brookfield IL, US
Timothy Hagan - Sugar Grove IL, US
Samuel C. Ramey - Naperville IL, US

Assignee:

Molex Incorporated - Lisle IL

International Classification:

H05K 3/02
H05K 3/10

US Classification:

29846, 29874, 29876

Abstract:

An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.

US Patent:

20080310167, Dec 18, 2008

Filed:

May 23, 2008

Appl. No.:

12/126657

Inventors:

VICTOR ZADEREJ - ST. CHARLES IL, US
KEVIN O'CONNOR - LISLE IL, US
CHARLIE MANLAPAZ - BROOKFIELD IL, US
TIMOTHY HAGAN - SUGAR GROVE IL, US
SAMUEL C. RAMEY - NAPERVILLE IL, US

International Classification:

F21V 29/00
H05K 7/20

US Classification:

362294, 361707

Abstract:

An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.

US Patent:

20120040565, Feb 16, 2012

Filed:

Feb 15, 2010

Appl. No.:

13/201719

Inventors:

Timothy R. Gregori - Lockport IL, US
Joseph D. Comerci - Elmhurst IL, US
Kevin O'Connor - Lisle IL, US
Herbert Endres - Munich, DE
Mikael Sigfridsson - Stockholm, SE

Assignee:

Molex Incorporated - Lisle IL

International Classification:

H01R 24/20

US Classification:

439660

Abstract:

A co-edge connector () is provided that includes a housing () that supports a plurality of terminals (). One side of the housing includes a slot () that is configured to accept a panel () and first terminal contacts () are positioned in the slot. An exposed support surface () extends from a wall () on a second side and second terminal contacts () extend above the support surface. In operation, if the panel inserted into the slot is inserted in a vertical direction, the second contacts can engage pads of panel where the panel is mounted on the housing by moving the panel in a vertical direction.

US Patent:

20200090866, Mar 19, 2020

Filed:

Sep 19, 2019

Appl. No.:

16/576438

Inventors:

Kevin Andrew O'Connor - Orland Park IL, US

International Classification:

H01G 4/08
H01B 3/16
H01L 29/40
H01L 49/02

Abstract:

In an embodiment, a dielectric structure comprising solid dielectric regions incorporating a plurality of regions of vacuum or gas. In certain embodiments, the dielectric constant of the regions of solid dielectrics have a dielectric constant greater than 4. In certain embodiments, each of the plurality of regions of vacuum or gas or the regions of solid dielectrics is anisotropic with an aspect ratio of at least four. In certain embodiments, the smallest average dimension of a plurality of regions of vacuum or gas and/or solid dielectrics have a length of less than 1 micron. In certain embodiments, the dielectric structure has a higher electrical energy density in the regions of vacuum or gas than in the solid matrix. In certain embodiments, one or more electrodes of the capacitive structure are coated with a solid insulating layer without an interface between a region of vacuum or gas and electrode.