Kevin P Ryan

US Patent:

6347919, Feb 19, 2002

Filed:

Dec 17, 1999

Appl. No.:

09/466416

Inventors:

Kevin Thomas Ryan - Wilmington MA
Peter Lawrence Kellerman - Essex MA
Frank Sinclair - Quincy MA
Ernest Everett Allen - Rockport MA
Roger Bradford Fish - Bedford MA

Assignee:

Eaton Corporation - Cleveland OH

International Classification:

B65G 4907

US Classification:

414217, 414805, 414939, 251326, 251329

Abstract:

A wafer processing apparatus includes a processing chamber having a top chamber portion and a bottom chamber portion, respectively. The apparatus further includes an annular ring valve associated with one of the top chamber portion and the bottom chamber portion which is operable to close the processing chamber for processing in a first position and open the processing chamber for access thereto in a second position. The ring valve, in the first position, provides a substantially uniform surface about an inner periphery of the closed processing chamber, and thereby facilitates uniform processing conditions. A method of accessing a wafer processing apparatus is also disclosed and includes moving an annular ring valve within a processing chamber between two positions. In the first position the annular ring valve sealingly blocks an access port of the processing chamber and thereby prohibits access thereto, and in the second position the annular ring valve does not block the access port, and permits access to the processing chamber. The annular ring valve has a substantially uniform inner peripheral surface, and thereby facilitates uniform processing conditions within the processing chamber when in the first position.

US Patent:

6429139, Aug 6, 2002

Filed:

Dec 17, 1999

Appl. No.:

09/466628

Inventors:

Kevin Thomas Ryan - Wilmington MA
Peter Lawrence Kellerman - Essex MA
Frank Sinclair - Quincy MA
Ernest Everett Allen - Rockport MA
Roger Bradford Fish - Bedford MA

Assignee:

Eaton Corporation - Cleveland OH

International Classification:

H01L 21302

US Classification:

438716, 438464, 438908, 438913, 414935, 414937, 414939, 414941, 4147441, 4147443, 29 2501

Abstract:

A wafer handling system for a wafer processing apparatus includes a wafer load lock chamber, a wafer processing chamber and a transfer chamber operatively coupled to the wafer load lock chamber and the wafer processing chamber. The transfer chamber includes a wafer transfer mechanism comprising a transfer arm pivotably coupled to a portion of the transfer chamber which forms an axis. The transfer arm is operable to rotate about the axis to transfer a wafer between the wafer load lock chamber and the process chamber in a single axis wafer movement. The invention also includes a method of transferring a wafer to a wafer processing apparatus. The method includes loading a wafer into a wafer load lock chamber and rotating a transfer arm into the wafer load lock chamber to retrieve the wafer therein. The method further includes rotating the transfer arm out of the wafer load lock chamber and into a process chamber to deposit the wafer therein, wherein the rotating of the transfer arm occurs in a single axis wafer movement.

US Patent:

6545676, Apr 8, 2003

Filed:

May 24, 1999

Appl. No.:

09/317540

Inventors:

Kevin M. Ryan - Lowell MA
Serge Elnitsky - Waltham MA

Assignee:

Parametric Technology Corporation - Needham MA

International Classification:

G06T 1720

US Classification:

345423, 345420

Abstract:

The present invention relates to providing a system and method for obtaining a tessellated approximation of an outer envelope of a geometrical representation of an object. The method of the invention can be implemented in any computer platform having a facility for creating a geometrical representation of an object. In particular, the computer-implemented method of the invention can be incorporated into a CAD/CAM system as one of the utilities provided by such a system.

US Patent:

6580428, Jun 17, 2003

Filed:

May 24, 1999

Appl. No.:

09/317541

Inventors:

Kevin M. Ryan - Lowell MA
Serge Elnitsky - Waltham MA

Assignee:

Parametric Technology Corporation - Needham MA

International Classification:

G06T 1720

US Classification:

345423, 345420

Abstract:

The present invention relates to a method and system for determining peripheral elements, e. g. , outer surfaces, of a geometrical representation of an object. The method of the invention can be implemented in any computer platform having a facility for creating a geometrical representation of an object. In particular, the computer-implemented method of the invention can be incorporated into a CAD/CAM system as one of the utilities provided by the system.

US Patent:

6794664, Sep 21, 2004

Filed:

Dec 4, 2003

Appl. No.:

10/728669

Inventors:

Robert J. Mitchell - Winchester MA
Kevin T. Ryan - Wilmington MA

Assignee:

Axcelis Technologies, Inc. - Beverly MA

International Classification:

H01J 3708

US Classification:

25049221, 2504923, 2504922, 2504911

Abstract:

An ion beam implanter includes an ion beam source for generating an ion beam moving along a beam line and a vacuum implantation chamber wherein a workpiece is positioned to intersect the ion beam for ion implantation of a surface of the workpiece by the ion beam. The ion beam implanter further includes a workpiece support structure coupled to the implantation chamber and supporting the workpiece. The workpiece support structure includes a chuck including a rotatable pedestal for supporting the workpiece. The workpiece support structure further includes a first rotatable reel coupled to and rotatable with the pedestal and a flexible, hollow cord carrying facilities such as coolant lines and electrical power conductors coupled to the rotatable reel such that, as the pedestal is rotated in a first direction, a length of the flexible cord that is wrapped around the first reel increases and, as the pedestal is rotated in an opposite direction, a length of the flexible cord that is wrapped around the first reel decreases.

US Patent:

20040079289, Apr 29, 2004

Filed:

Oct 23, 2002

Appl. No.:

10/278640

Inventors:

Peter Kellerman - Essex MA, US
Kevin Ryan - Wilmington MA, US
Robert Mitchell - Winchester MA, US

International Classification:

C23C016/00

US Classification:

118/728000

Abstract:

An apparatus for processing a semiconductor wafer. The apparatus according to the present invention comprises a wafer port flange including an electrostatic chuck and a top plate including a lip. The electrostatic chuck defines a circumferential gas distribution groove and a gas gap positioned between a backside of a semiconductor wafer and the electrostatic chuck. The lip is positioned to shield an outside band of the wafer. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).

US Patent:

63053160, Oct 23, 2001

Filed:

Jul 20, 2000

Appl. No.:

9/619839

Inventors:

William F. DiVergilio - Beverly MA
Peter L. Kellerman - Essex MA
Kevin T. Ryan - Wilmington MA

Assignee:

Axcelis Technologies, Inc. - Beverly MA

International Classification:

C23C 1600
H05H 100
H05H 146

US Classification:

118723I

Abstract:

A wafer processing system is provided. The system includes a wafer handling system for introducing semiconductor wafers into a processing chamber. An oscillator is operatively coupled to an antenna for igniting a plasma within the processing chamber. The plasma and antenna form a resonant circuit with the oscillator, and the oscillator varies an output characteristic associated therewith based on a load change in the resonant circuit during plasma ignition.

US Patent:

20220384156, Dec 1, 2022

Filed:

May 25, 2021

Appl. No.:

17/329883

Inventors:

- Santa Clara CA, US
Simon Ruffell - South Hamilton MA, US
Kevin R. Anglin - Somerville MA, US
Tyler Rockwell - Wakefield MA, US
Christopher Campbell - Newburyport MA, US
Kevin M. Daniels - Lynnfield MA, US
Richard J. Hertel - Boxford MA, US
Kevin T. Ryan - Wilmington MA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01J 37/32

Abstract:

A substrate holder assembly including a substrate platen, the substrate platen disposed to support a substrate at a substrate position, a halo ring, the halo ring being disposed around the substrate position, and an outer halo being disposed around the halo ring and defining a first aperture, wherein the outer halo is disposed to engage the halo ring, the halo ring being disposed at least partially within the first aperture, the halo ring defining a second aperture, concentrically positioned within the first aperture, wherein the outer halo and the halo ring are formed at least partially of silicon, silicon carbide, doped silicon, quartz, and ceramic.