Kurt C Conrath

US Patent:

51363666, Aug 4, 1992

Filed:

Nov 5, 1990

Appl. No.:

7/609355

Inventors:

Nicolaas H. Worp - Margate FL
Bruce J. Freyman - Plantation FL
Kurt C. Conrath - Lauderhill FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 3902
H01L 2328
H05K 702
H05K 116

US Classification:

357 72

Abstract:

An overmolded semiconductor package (150) is formed by electrically and mechanically attaching a semiconductor device (100) to a substrate (110) having at least one hole (130). A plastic molding compound (140) is overmolded around the semiconductor device 100) so as to encapsulate the device, the molding compound (140) extending at least partially into the substrate hole (130) to form an anchor (135) to aid in bonding the molding compound to the substrate. An alternate embodiment of the invention forms a pedestal (449) from the portion of the molding compound extending beyond the surface of the substrate. The pedestal functions as an anchor to aid in bonding the molding compound (440) to the substrate, and also as a spacer to maintain a preselected clearance between the substrate (410) and the printed circuit board (460). The portion of the molding compound extending beyond the surface of the substrate may also be used to form an alignment pin (548). The pin functions as an anchor to aid in bonding the molding compound to the substrate, and also as an alignment aid to maintain positional relationships between the substrate and the printed circuit board.