Kurt M Striny

age ~91

from Lakewood, NJ

Also known as:
  • Kurt Striny
  • H R
  • Striny Km

Kurt Striny Phones & Addresses

  • Lakewood, NJ
  • Emmaus, PA
  • 43 Channel Rd, Toms River, NJ 08753 • 7322553392
  • 1703 Lacebark Rd, Dover Township, NJ 08755 • 7325570580 • 7325573580 • 7322553392
  • Kenilworth, NJ
  • Providence, RI
  • 1703 Lacebark Ct, Toms River, NJ 08755 • 7325570580

Work

  • Position:
    Retired

Education

  • Degree:
    Graduate or professional degree

Resumes

Kurt Striny Photo 1

Kurt Striny

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Us Patents

  • Integrated Circuit Packages

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  • US Patent:
    H73, Jun 3, 1986
  • Filed:
    Aug 25, 1983
  • Appl. No.:
    6/526413
  • Inventors:
    Kenneth K. Claasen - Lower Nazareth Township, Northampton County PA
    Ronald N. Graver - Allentown PA
    Frank P. Pelletier - Allentown PA
    Kurt M. Striny - Emmaus PA
    Ronald J. Wozniak - Allentown PA
  • Assignee:
    AT&T Bell Laboratories - Murray Hill NJ
  • International Classification:
    H01L 2328
  • US Classification:
    357 72
  • Abstract:
    A package for wire-bonded semiconductor integrated circuit chips is disclosed. The chip is covered by a protective layer of material such as room temperature vulcanizing silicone rubber. The thickness of the layer is such that it covers a portion of the arched wires, thereby concentrating the stresses away from the wire-ball bond interfaces. The chip is encapsulated in a plastic material while providing an air gap between the plastic and protective layer.
  • Chip Carrier Package

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  • US Patent:
    46426701, Feb 10, 1987
  • Filed:
    Dec 2, 1983
  • Appl. No.:
    6/557596
  • Inventors:
    Kurt M. Striny - Emmaus PA
  • Assignee:
    AT&T Bell Laboratories - Murray Hill NJ
  • International Classification:
    H01L 2348
    H01L 2330
  • US Classification:
    357 68
  • Abstract:
    Described is an improved lead design for an integrated circuit chip carrier. The lead incorporates a U- or V-bend in the portion of the lead extending along the edge of the chip carrier to adapt the lead to either surface or socket mounting. The bend can also be used for locking the lead into the socket and, in conjunction with grooves in the sidewall of the chip carrier, for lead alignment retention.

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Kurt Striny

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