Larry Willi Conley

US Patent:

48781550, Oct 31, 1989

Filed:

Sep 30, 1988

Appl. No.:

7/252260

Inventors:

Larry R. Conley - Fountain Valley CA

International Classification:

H05K 118

US Classification:

361401

Abstract:

Decoupling capacitance is provided with negligible inductance in a high speed discrete wire logic panel by the use of SMT (surface mounting) capacitors that are mounted in holes in the circuit board. A hole is formed in the circuit board under each location where a dual-in-line IC (integrated circuit) is to be mounted, and an SMT capacitor is mounted in the hole, with the opposite terminals of the capacitor soldered to the conductive layers on opposite board surfaces. Each quantity of solder extends substantially in the plane of a corresponding conductive layer. Only one side of each capacitor terminal is soldered to a conductive layer, to permit flux washout. In the PGA (pin grid array) area of the circuit board, a capacitor is selectively mounted under an IC by removing a pin from a hole lying under the pin-free area in the center of the IC, and installing a capacitor in the hole.

US Patent:

48222887, Apr 18, 1989

Filed:

Sep 14, 1987

Appl. No.:

7/096680

Inventors:

Larry Conley - Fountain Valley CA

International Classification:

H05K 100

US Classification:

439 84

Abstract:

A terminal system is described for use with circuit boards, which enables the terminals to be subsequently interconnected using any of a variety of point-to-point wiring methods. Each terminal includes a sleeve with a plated-through hole, the upper portion of the hole holding a contact clip member that receives leads of circuit components, and the lower portion of the hole formed to receive any of a variety of wire termination devices. A circuit board assembly is formed by first press-fitting the sleeves into holes in the board, from the component side of the board. A selected one of the many types of wire termination devices are later inserted into the bottom of the sleeve from the wiring side of the board. Each sleeve has a spline at its lower portion and a barb at its upper portion, which together resist rotation or withdrawal of the sleeve from its press-fitted position while avoiding warping of the board.

US Patent:

43947115, Jul 19, 1983

Filed:

May 27, 1980

Appl. No.:

6/153565

Inventors:

Larry R. Conley - Fountain Valley CA

Assignee:

Interconnection Technology, Inc. - Costa Mesa CA

International Classification:

H05K 118

US Classification:

361408

Abstract:

A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.

US Patent:

42427193, Dec 30, 1980

Filed:

Jun 1, 1979

Appl. No.:

6/044404

Inventors:

Larry R. Conley - Fountain Valley CA

Assignee:

Interconnection Technology, Inc. - Costa Mesa CA

International Classification:

H05K 118

US Classification:

361400

Abstract:

A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.