Larry Dotson

US Patent:

20210078193, Mar 18, 2021

Filed:

Apr 30, 2018

Appl. No.:

16/630726

Inventors:

- Midland MI, US
William E. Gee - Collegeville PA, US
Larry Dotson - Midland MI, US
Paul OConnell - Lake Jackson TX, US
Jonathan J. Zieman - Midland MI, US
John Lund - Midland MI, US

Assignee:

Dow Global Technologies LLC - Midland MI

International Classification:

B26D 7/01
B26D 1/04

Abstract:

A method for cutting a film of material and a cutting device for cutting the film of material are described herein. The cutting device includes a film support plate, and a pressure plate configured to move relative to the film support plate to hold the film of material on the film support plate. The device further includes one or more blades, and a linear actuator configured to move the one or more blades relative to the film support plate to cut the film of material held on the film support plate.