Larry D Olson

US Patent:

53346963, Aug 2, 1994

Filed:

Dec 18, 1992

Appl. No.:

7/993147

Inventors:

Larry D. Olson - Viroqua WI
Jeffrey R. Kamla - West Salem WI
Henry R. Johnson - West Salem WI

Assignee:

Allied Signal Inc. - Morris Township, Morris County NJ

International Classification:

C08G 7310
C08L 7908

US Classification:

528322

Abstract:

A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a reactive brominated aromatic compound, particularly a member of the group consisting of group consisting of tribromophenyl maleimide, tribromostyrene, and pentabromobenzyl acrylate; and (c) a multifunctional nitrogen compound, particularly dicyandiamide, and optionally (d) ethylene bistetrabromophthalimide.

US Patent:

40235564, May 17, 1977

Filed:

May 27, 1975

Appl. No.:

5/581250

Inventors:

Richard George Sarazin - Onalaska WI
Larry Dale Olson - Viroqua WI

Assignee:

Universal Oil Products Company - Des Plaines IL

International Classification:

F24J 302

US Classification:

126271

Abstract:

Flat plate absorber member includes a flat heat absorbing sheet of a thin metal foil such as copper, or a thin plastic film such as polyvinyl fluoride, bonded to a channeled substrate, and particularly to a plastic laminate such as a glass epoxy laminate. The improved absorber member provides an energy collecting efficiency which is much greater than that of a much more expensive conventional collector having a series of copper tubes soldered to a copper sheet. The absorber is preferably made by the method of taking a base sheet of fully cured glass epoxy laminate and overlaying it with a precut, patterned intermediate layer of semi-cured glass expoxy which defines the depth of the side walls of the channels. The cover sheet of metal foil or plastic film is then placed over the semi-cured glass epoxy intermediate layer and heat and pressure are applied to bond the semi-cured glass epoxy to the cover sheet and to the previously cured base sheet.

US Patent:

55083285, Apr 16, 1996

Filed:

Nov 17, 1994

Appl. No.:

8/340962

Inventors:

Larry D. Olson - Viroqua WI

Assignee:

AlliedSignal Inc. - Morris Township, Morris County NJ

International Classification:

C08L 6300

US Classification:

523445

Abstract:

A curable epoxide composition consists essentially of curable epoxides, dicyandiamide as a curing agent in an amount less than needed to fully cure the epoxides, an imidazole in an amount exceeding that needed as a catalyst and capable of curing the epoxides in combination with the dicyandiamide, a reactivity controller for the imidazole to reduce the curing speed, and a solvent. The use of undesirable solvents such as DMF is reduced. A glass transition temperature greater than 135. degree. C. is obtained in the cured composition and is maximized by balancing the amounts of dicyandiamide, the imidazole, and the reactivity controller.

US Patent:

52925579, Mar 8, 1994

Filed:

Nov 16, 1992

Appl. No.:

7/976866

Inventors:

Larry D. Olson - Viroqua WI

Assignee:

Allied-Signal Inc. - Morris Township, Morris County NJ

International Classification:

B05D 100

US Classification:

427437

Abstract:

Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate with an electroless copper plating solution.

US Patent:

39960927, Dec 7, 1976

Filed:

Feb 6, 1976

Appl. No.:

5/656052

Inventors:

Richard George Sarazin - Onalaska WI
Larry Dale Olson - Viroqua WI

Assignee:

Universal Oil Products Company - Des Plaines IL

International Classification:

C09J 500
C09J 700

US Classification:

156309

Abstract:

Flat plate absorber member includes a flat heat absorbing sheet of a thin metal foil such as copper, or a thin plastic film such as polyvinyl fluoride, bonded to a channeled substrate, and particularly to a plastic laminate such as a glass epoxy laminate. The improved absorber member provides an energy collecting efficiency which is much greater than that of a much more expensive conventional collector having a series of copper tubes soldered to a copper sheet. The absorber is preferably made by the method of taking a base sheet of fully cured glass epoxy laminate and overlying it with a precut, patterned intermediate layer of semi-cured glass epoxy which defines the depth of the side walls of the channels. The cover sheet of metal foil or plastic film is then placed over the semi-cured glass epoxy intermediate layer and heat and pressure are applied to bond the semi-cured glass epoxy to the cover sheet and to the previously cured base sheet.

US Patent:

54180643, May 23, 1995

Filed:

Dec 15, 1993

Appl. No.:

8/168005

Inventors:

Larry D. Olson - Viroqua WI

Assignee:

Allied Signal Inc. - Morris Township, Morris County NJ

International Classification:

B32B 1508
B32B 2738

US Classification:

428418

Abstract:

Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate first with a solution of a catalytic metal and then with an electroless copper plating solution.

US Patent:

44142641, Nov 8, 1983

Filed:

Jan 13, 1983

Appl. No.:

6/457778

Inventors:

Larry D. Olson - Viroqua WI

Assignee:

UOP Inc. - Des Plaines IL

International Classification:

B32B 516

US Classification:

428241

Abstract:

Multilayer laminates and substrates for carriers of silicon chips which are used in circuitry boards will comprise woven hybrid glass cloth formed from fiberglass and a second material which possesses a coefficient of thermal expansion of less than about 5. times. 10. sup. -6 in/in/. degree. C. The resulting laminates will be thermally and dimensionally stable. As an example, a hybrid glass cloth may be formed in which the warp yarn of said cloth is fiberglass and the fill yarn is boron nitride. The resulting cloth may be used to form laminates which possess a coefficient of thermal expansion similar in nature to that of a chip carrier such as ceramic, thus minimizing the danger of a solder fracture.

US Patent:

48763250, Oct 24, 1989

Filed:

Apr 28, 1988

Appl. No.:

7/187158

Inventors:

Larry D. Olson - Viroqua WI
Eugene P. Pallardy - La Crosse WI

Assignee:

Allied-Signal Inc. - Morris Township, Morris County NJ

International Classification:

C08G 7310

US Classification:

528170

Abstract:

A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i. e. a vinyl benzyl ether of a bisphenol).

Address:

4000 Beverly Dr, Onalaska, WI 54650

Phone:

6087835416

VIN:

2GNALDEK9C1137290

Make:

CHEVROLET

Model:

EQUINOX

Year:

2012

Address:

2315 E Saint George Dr, Sioux Falls, SD 57103

VIN:

1FTPW14V38KB95214

Make:

FORD

Model:

F-150

Year:

2008