Larry D Pottebaum

US Patent:

7958629, Jun 14, 2011

Filed:

Jun 15, 2009

Appl. No.:

12/484591

Inventors:

Philip H. Thompson - Solon IA, US
Larry D. Pottebaum - Marion IA, US

Assignee:

Skyworks Solutions, Inc. - Woburn MA

International Classification:

H05K 3/34
H05K 3/30

US Classification:

29840, 29832

Abstract:

A method for making an electronic module with an integrated electromagnetic shield uses surface mount shield wall components. At least one electronic component and two or more of the shield wall components are mounted on a surface of a circuit board panel using a pick-and-place process. Each shield wall component has a conductive portion and a non-conductive portion mounted in contact with the surface of the circuit board panel. The mounted shield wall components form a conductive wall to electromagnetically shield the electronic component. The non-conductive portion of one or more of the mounted shield wall components is sawn through, leaving some or all of the conductive portion of the mounted shield wall components. A top conductive shield can be applied. The non-conductive portions can provide stability during a reflow soldering process, while the sacrificial non-conductive portions are sawn through so that they can be removed to reduce the amount of area occupied by the overmoldable shield structure.

US Patent:

20080112151, May 15, 2008

Filed:

Feb 19, 2007

Appl. No.:

11/708382

Inventors:

Philip H. Thompson - Solon IA, US
Larry D. Pottebaum - Marion IA, US

International Classification:

H05K 7/00

US Classification:

361818, 257E23005

Abstract:

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

US Patent:

20120036710, Feb 16, 2012

Filed:

Jun 13, 2011

Appl. No.:

13/159276

Inventors:

Philip H. Thompson - Solon IA, US
Larry D. Pottebaum - Marion IA, US

Assignee:

SKYWORKS SOLUTIONS, INC. - Woburn MA

International Classification:

H05K 3/30

US Classification:

29832

Abstract:

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

US Patent:

7198987, Apr 3, 2007

Filed:

Mar 4, 2004

Appl. No.:

10/793618

Inventors:

Robert W. Warren - Newport Beach CA, US
Suresh Jayaraman - Ladera Ranch CA, US
Larry D. Pottebaum - Marion IA, US

Assignee:

Skyworks Solutions, Inc. - Irvine CA

International Classification:

H01L 21/44

US Classification:

438112, 438124, 438126, 438127

Abstract:

According to one exemplary embodiment, an overmolded package comprises a semiconductor die situated on a substrate. The overmolded package further comprises an overmold situated over the semiconductor die and the substrate, where the overmold has a top surface. The overmolded package further comprises a conductive layer situated on the top surface of the overmold, where the conductive layer comprises a conductive polymer, and where the conductive layer forms an EMI and RFI shield. According to this exemplary embodiment, the overmolded package can further comprise a post situated over the substrate, where the post is connected to the conductive layer. The overmolded package can further comprise a hole situated in the overmold, where the hole is situated over the post, where the hole is filled with the conductive polymer, and where the conductive polymer is in contact with the post.

US Patent:

20190394912, Dec 26, 2019

Filed:

May 31, 2019

Appl. No.:

16/428081

Inventors:

- Woburn MA, US
Larry D. Pottebaum - Marion IA, US

International Classification:

H05K 9/00
H01L 23/00
H05K 3/34
H01L 23/552

Abstract:

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

US Patent:

20150070861, Mar 12, 2015

Filed:

Sep 12, 2014

Appl. No.:

14/485504

Inventors:

- Woburn MA, US
Larry D. Pottebaum - Marion IA, US

International Classification:

H05K 9/00

US Classification:

361760

Abstract:

According to certain aspects, a circuit board panel includes a first module circuit board and a second module circuit board arranged to define a space that runs between a first portion of the periphery of the first module circuit board and a portion of the periphery of the second module circuit board; and a plurality of shield components each extending across the space and including a first conductive portion mounted along the first portion of the periphery of the first module circuit board, a second conductive portion mounted along the portion of the periphery of the second module circuit board, and a non-conductive portion extending between the first conductive portion and the second conductive portion, the first and second conductive portions of each of the plurality of shield components configured to provide electromagnetic shielding for at least one electronic component mounted on the first and second module circuit boards, respectively.