Larry W Potter

US Patent:

7638798, Dec 29, 2009

Filed:

May 10, 2007

Appl. No.:

11/801443

Inventors:

Jim Schloss - Tigard OR, US
Michele Winz - Woodbum OR, US
Sam Mallicoat - Portland OR, US
Wolfram Urbanek - Camas WA, US
Guang Li - Beaverton OR, US
Larry Potter - Colorado Springs CO, US
Kevin Shea - Vancouver WA, US

Assignee:

Coherent, Inc. - Santa Clara CA

International Classification:

H01L 23/58

US Classification:

257 48, 257E33001, 355 72, 355 53, 2502521

Abstract:

A laminated wafer sensor structure includes a housing layer having pocket openings formed therein, a circuit layer having a sensor element and electronic components mounted for registration with the pocket openings in the housing layer, and a rigid back layer. The laminated structure is suitable for handling by conventional robotic wafer handling systems. The wafer sensor structure is adapted for electrical connection to a base station that is also adapted for connection to a host computer system to facilitate communication among the sensor structure, the base station and the host computer.