Laurence D Schultz

US Patent:

6702654, Mar 9, 2004

Filed:

Feb 7, 2001

Appl. No.:

09/778986

Inventors:

Arun K. Nanda - Orlando FL
Jose Omar Rodriguez - Orlando FL
Laurence D. Schultz - Kissimmee FL
Charles A. Storey - Orlando FL

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

B24B 100

US Classification:

451 56, 451 72, 451443, 451533, 451539, 29423, 29460, 51295

Abstract:

The present invention provides an improved conditioning wheel for conditioning polishing pads used to polish semiconductor wafers. In one embodiment, the conditioning wheel includes a planar body having a metal surface located thereon. The metal surface has abrasive particles embedded therein and a retainer coating deposited over the metal surface and the abrasive particles. The retainer coating inhibits the abrasive particles from dislodging during a conditioning process.

US Patent:

6896583, May 24, 2005

Filed:

Feb 6, 2001

Appl. No.:

09/731402

Inventors:

Jose Omar Rodriquez - Orlando FL, US
Laurence Darnell Schultz - Kissimmee FL, US
Charles A. Storey - Orlando FL, US

Assignee:

Agere Systems, Inc. - Allentown PA

International Classification:

B24B001/00

US Classification:

451 5, 451 41, 451 56, 451285

Abstract:

A method () for conditioning a polishing pad () used for polishing semiconductor wafers (). The degradation in conditioning performance of a conditioning device () is accounted for by controlling at least one of the conditioning velocity (), conditioning down force () and conditioning time (). The amount of the degradation of conditioning performance during consecutive uses of a conditioning device () may be determined by measuring the friction force () between the conditioning device () and the polishing pad (), or it may be predicted on the basis of an algorithm () developed from data obtained from a plurality of representative conditioning devices ().

US Patent:

7695589, Apr 13, 2010

Filed:

Jul 21, 2004

Appl. No.:

10/897286

Inventors:

David A. Stark - Dallas TX, US
Laurence D. Schultz - Richardson TX, US
Neal T. Murphy - Richardson TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

C23F 1/00
C09K 3/14
H01L 21/306

US Classification:

15634512, 134 50, 134902, 134 991, 15634513

Abstract:

The present invention provides a system () for conditioning multi-component slurries utilized in chemical mechanical polishing (CMP) of semiconductor wafers (). The system provides a first slurry component (), and a second slurry component (). A conditioning component () has first and second inlets, and an outlet operatively coupled to a dispensing system (). First and second flow control components () are operably intercoupled between the first and second inlets and the first and second slurry components, respectively. The system further provides a megasonic energy source (), adapted to generate an energy field () across the conditioning component. A conveyance component () conducts the slurry components from the inlets through the energy field, and delivers a final mixture () of multi-component slurry to the outlet.

US Patent:

20020106829, Aug 8, 2002

Filed:

Feb 6, 2001

Appl. No.:

09/777470

Inventors:

Arun Nanda - Orlando FL, US
Jose Rodriguez - Orlando FL, US
Laurence Schultz - Kissimmee FL, US
Charles Storey - Orlando FL, US

International Classification:

H01L021/00

US Classification:

438/056000

Abstract:

The present invention provides an improved conditioning wheel for conditioning polishing pads used to polish semiconductor wafers. The conditioning wheel includes a planar body and a homogeneous abrasive layer located on the planar body wherein the homogenous abrasive layer includes abrasive protrusions comprised of a same material as the homogenous abrasive layer.

US Patent:

20060276042, Dec 7, 2006

Filed:

Aug 18, 2006

Appl. No.:

11/465501

Inventors:

David Stark - Dallas TX, US
Laurence Schultz - Richardson TX, US
Neal Murphy - Richardson TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 21/461

US Classification:

438692000

Abstract:

The present invention provides a system () for conditioning multi-component slurries utilized in chemical mechanical polishing (CMP) of semiconductor wafers (). The system provides a first slurry component (), and a second slurry component (). A conditioning component () has first and second inlets, and an outlet operatively coupled to a dispensing system (). First and second flow control components () are operably intercoupled between the first and second inlets and the first and second slurry components, respectively. The system further provides a megasonic energy source (), adapted to generate an energy field () across the conditioning component. A conveyance component () conducts the slurry components from the inlets through the energy field, and delivers a final mixture () of multi-component slurry to the outlet.

US Patent:

60838388, Jul 4, 2000

Filed:

May 20, 1998

Appl. No.:

9/082162

Inventors:

Randolph H. Burton - Windermere FL
Yaw S. Obeng - Orlando FL
Laurence D. Schultz - Kissimmee FL

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H01L 21304

US Classification:

438691

Abstract:

The present invention provides a method of planarizing a surface on a semiconductor wafer containing metal. In one embodiment, the method comprises selecting a slurry that contains conventional components of an abrasive and an oxidant. The oxidant is known to have a known rate of oxidation and is capable of oxidizing the metal. This embodiment further comprises reducing a rate of exposure of the metal to the oxidant by altering a property of the slurry, oxidizing the metal at the reduced rate to form an oxide of the metal, and removing the oxide with the abrasive to produce a planarized surface of the semiconductor wafer.

US Patent:

59803630, Nov 9, 1999

Filed:

Jan 22, 1999

Appl. No.:

9/235226

Inventors:

Scott Meikle - Boise ID
Laurence D. Schultz - Orlando FL

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B24B 100

US Classification:

451 41

Abstract:

The present invention is an under-pad placed between a polishing pad and a platen of a planarizing machine used in chemical-mechanical planarization of semiconductor wafers. The under-pad has a body and a plurality of thermal conductors positioned in the body to conduct heat through the body. The body has a top face upon which the polishing pad is positionable and a bottom face engageable with the platen. In operation, heat from the platen and polishing pad flows through the thermal conductors to reduce temperature gradients across the planarizing surface of the polishing pad.

US Patent:

58713921, Feb 16, 1999

Filed:

Jun 13, 1996

Appl. No.:

8/662483

Inventors:

Scott Meikle - Boise ID
Laurence D. Schultz - Orlando FL

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B24B 100

US Classification:

451 56

Abstract:

The present invention is an under-pad placed between a polishing pad and a platen of a planarizing machine used in chemical-mechanical planarization of semiconductor wafers. The under-pad has a body and a plurality of thermal conductors positioned in the body to conduct heat through the body. The body has a top face upon which the polishing pad is positionable and a bottom face engageable with the platen. In operation, heat from the platen and polishing pad flows through the thermal conductors to reduce temperature gradients across the planarizing surface of the polishing pad.