Lee E Reid

US Patent:

51597004, Oct 27, 1992

Filed:

Mar 13, 1991

Appl. No.:

7/668666

Inventors:

Lee R. Reid - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G02B 610
G02B 514

US Classification:

385 14

Abstract:

A circuit composed of a circuit board of crystalline elemental silicon slice and circuit components in the form of semiconductor integrated circuits therein which are preferably formed of a Group III-V compound. Signals from each of the integrated circuits are transmitted to other integrated circuits on the board or externally of the board either by conventional printed conductors on the board or by a laser formed in each integrated circuit at each output terminal thereon which transmits light signals along light transmitting members in the silicon board to detectors at the input locations on other ones of the integrated circuits on the board for external to the board. The light signal is transferred from an integrated circuit output to an integrated circuit input or to a device external to the board by means of light transmitting members. These light transmitting members may be light conducting waveguides positioned either on the surface of the board or in grooves formed therein. Alternatively, the light transmitting members can be silicon dioxide paths formed in the silicon circuit board by selective oxidation of the silicon board to form silicon dioxide light transmitting paths therein.

US Patent:

49513702, Aug 28, 1990

Filed:

Sep 1, 1989

Appl. No.:

7/401702

Inventors:

Lee R. Reid - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 4122

US Classification:

29 2535

Abstract:

An intelligent multiprobe tip comprising a mounting member comprised essentially of piezoelectric material wherein, through appropriately locating metalized areas, the characteristics of the piezoelectric material are employed to insulate selected regions from each other while providing an appropriate force-induced output signal responsive to the contact of an attached tip with a movable work piece.

US Patent:

45354243, Aug 13, 1985

Filed:

Jun 3, 1982

Appl. No.:

6/384451

Inventors:

Lee R. Reid - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G11C 1700

US Classification:

365 63

Abstract:

A memory circuit including several semiconductor substrates, each containing addressable memory elements, address receiving circuitry for receiving address signals and for providing data from the memory in response to the address signals, control circuitry for receiving control signals and for controlling the reading and writing of the memory elements, and interconnection circuitry including elevated portions of the semiconductor substrate connected to contact paths of the semiconductor substrate located above to provide electrical continuity between the addressable circuits of each semiconductor substrate and electrical continuity between the control circuits of each semiconductor substrate.

US Patent:

45728860, Feb 25, 1986

Filed:

Nov 3, 1983

Appl. No.:

6/548545

Inventors:

Lee R. Reid - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G03C 536
H01L 2166

US Classification:

430152

Abstract:

A method for optically marking selected integrated circuit bars of visual identification. In one embodiment a layer for photosensitive material applied to a portion of all of the bars on a wafer prior to testing. Selected bars are marked by directing a beam of radiant energy at the photosensitive material, which changes opacity and/or color in the irradiated region.

US Patent:

46600663, Apr 21, 1987

Filed:

Aug 19, 1985

Appl. No.:

6/767063

Inventors:

Lee R. Reid - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2714

US Classification:

357 30

Abstract:

An image focal plane array is disclosed including a first substrate having a first surface containing image detection elements that are interconnected to metallized layers on the opposite surface. The first substrate area is located above a second semiconductor substrate containing elevated portions that are metal coated and contacting the metallized portions on the opposite surface of the the first substrate to provide for electrical interconnection with the detection elements on the first substrate. A second structure is also illustrated which includes the image focal point array located on a cold finger and adjacent to the image focal plane array on the same cold finger is a stack of at least two silicon substrates containing support circuitry for the focal plane array. The circuitry on these semiconductor substrate stacks are interconnected by having at least one of the substrates including elevated portions to provide electrical interconnection between the two or more stack substrates.

US Patent:

43389503, Jul 13, 1982

Filed:

Sep 22, 1980

Appl. No.:

6/189400

Inventors:

Carl A. Barlow - Plano TX
Lee R. Reid - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

A61B 502

US Classification:

128687

Abstract:

An improved system and method for sensing and measuring heart beat. A body-mountable instrument is provided having a first sensor for detecting pulsing of a user's blood resulting from the user's heart beat and body movement and generating a first electrical signal indicative thereof and a second sensor for detecting the user's body movement and generating a second electrical signal indicative thereof. The instrument further includes a processor responsive to the first and second electrical signals for determining the period of the second electrical signal and for subtracting a first portion of the first electrical signal occurring during a first time interval from a corresponding portion of the first electrical signal occurring during a second time interval. The second time interval is separated from the first time interval by a time period nt, where n is an integer and t is the period of the second electrical signal, so that the body movement component is removed from the first electrical signal, yielding the true heart beat signal.

US Patent:

48885509, Dec 19, 1989

Filed:

Jul 19, 1983

Appl. No.:

6/515441

Inventors:

Lee R. Reid - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01R 106

US Classification:

324158P

Abstract:

A multiprobe tip assembly, and method of making same, for quality control testing of an integrated circuit wafer characterized by the precision control of the assembly in the z-axis. The assembly includes a probe tip mounting support member having at least one electrically conductive path disposed thereon, an electrically conductive probe tip member affixed thereto, and means for electrically coupling the probe tip member to the electrically conductive path. The improvement in combination with this assembly comprises the probe tip mounting support member being substantially composed of a high resistance piezoelectric material electrically responsive to mechanical pressure, means for subjecting the mounting support member to mechanical pressure caused of by probe tip member contact with the intergrated circuit wafer so that a piezoelectric voltage is produced therein, and at least one means for electrically coupling a voltage detection means to the support member for detecting the mechanically induced piezoelectric voltage so that z-axis control is precisely maintained relative to piezoelectric voltage amplitude.

US Patent:

45859914, Apr 29, 1986

Filed:

Mar 13, 1985

Appl. No.:

6/710959

Inventors:

Lee R. Reid - Plano TX
Tommy D. Cody - Garland TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01R 3126
G01R 104

US Classification:

324158P

Abstract:

A high density multiprobe including a multiprobe on a semiconductor substrate with contact pads selectively positioned in relation to the contacts of a device to be tested. Each of the selectively positioned contacts on the multiprobe semiconductor substrate include an elevated conductive surface that makes physical and electrical contact with the contacts of the device to be tested. In addition, the elevated conductive surfaces on the multiprobe are conductively connected to interface terminals on the semiconductor substrate to allow test signals to be input and output from the multiprobe device during testing. The multiprobe semiconductor substrate is also capable of containing onboard circuitry including buffers and logic circuitry for processing the test signals to be sent to and received from the device under test. A multiprobe testing device is also disclosed that includes the multiprobe semiconductor substrate with elevated contacts to allow for the testing of a semiconductor device.