Abstract:
A machine for wafering bars of quartz or other minerals wherein a plurality of wafers can be manufactured by a simultaneous pass of the machine is provided. The structure comprises a framework, an implement which supports the bars that are to be wafered, in which the implement is rotatably driven, and a cutting spindle having a plurality of cutting implements thereon similarly supported on the framework and similarly driven so as to cut many wafers at a time. Further provided is a mechanism for advancing the cutting mechanism to provide an incremental increase in depth of the cut as the process is being performed. Structure is also included for supporting a goniometer which determines and assures that the correct angulation between the crystals and the cutting utensil exists so as to provide wafers which are properly machined and cut at the specified angle.