Leo H. Webster - Cary NC Lawrence Shungwei Mok - Brewster NY Vinod Kamath - Raleigh NC Mohanlal S. Mansuria - Apex NC
Assignee:
International Business Machine Corp.
International Classification:
H05K 720
US Classification:
165121
Abstract:
An integrated air mover/heatsink for cooling semiconductor chip packages supports disks to rotate within the heat sink parallel to a heat receiving surface so that the heat sink acts as an enclosing housing for the disks. The heat sink preferably defines enclosing aperatures for respective disks which are closely spaced and coextensive heat with transfer surfaces over which air is forced by rotation of the disks. By so arranging the disks and enclosing aperature walls parallel to the heat receiving surface, a forced intimate flow of air over heat sink surfaces is achieved in a low profile configuration. Alternative implementations provide cooling for multiple chips and various arrangements for intake and exhaust of cooling air.
Card Insulator And Guide For A Computer System Having Hot Plugable Adapter Cards
Cynthia M. Grosser - Apex NC Mohanlal Savji Mansuria - Apex NC Leo Harold Webster - Cary NC
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 900
US Classification:
361752
Abstract:
A removable card insulator and guide prevents inadvertent shorting during the insertion or removal of an adapter card into a "hot-plug" computer system. The card insulator includes perpendicular first and second planar portions. When installed in a computer system, the first planar portion is positioned perpendicular to the motherboard, and the second planar portion is positioned parallel to the motherboard such that any components on the motherboard are positioned between the second planar portion and the motherboard. The second planar portion includes a slot through which an adapter card connector can be passed to mate with a connector on the motherboard. A step has perpendicular riser and tread portions, wherein the riser is attached perpendicular to the second planar portion, such that the tread is parallel to and offset from the second planar portion. When installed in the computer system, the tread is closer to the motherboard than the second planar portion and provides protection against the inadvertent shorting of an adapter card bracket to the motherboard. The opposing edges of the card insulator are inserted into guides attached to opposing walls of the computer system.
Cooling System For A Computer System Having Dual Fans And A Movable Baffle
Karl Klaus Dittus - Raleigh NC Mohanlal S. Mansuria - Apex NC Martin Joseph Crippen - Apex NC Jason Aaron Matteson - Raleigh NC Leo H. Webster - Cary NC
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 720
US Classification:
361695
Abstract:
A computer system includes a housing that is divided into three compartments; two fan compartments, each containing a fan, and a third compartment containing heat generating electronic components. The air discharged from the fans flows through outlets in the fan compartments and into the third compartment to cool the electronic components. A single baffle is rotatably coupled between the two fan compartments using a vertically oriented hinge. When one of the fans fails, the air pressure from the working fan rotates the baffle until it covers the outlet of the fan compartment containing the failed fan. This enhances the flow of air from the working fan into the third compartment, and restricts the reverse flow of air through the dead fan compartment. When both fans are functioning, air pressure from both fans moves the baffle to a "midway" or "neutral" position, such that the air from both fans flows into the third compartment.
Leo H. Webster - Cary NC Mohanlal Savji Mansuria - Apex NC Vinod Kamath - Raleigh NC
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 712 H05K 500
US Classification:
248694
Abstract:
A mounting tray for a hard disk drive has a base, a front wall, and a pair of side walls. A pair of latching mechanisms are located in each side wall. Each latching mechanism has a slide and a spring-like fastener. The fasteners have an unlocked position where they are biased away from the tray, and a locked position where the slides capture them against the side walls. A tapered pin extends inward from each fastener. With the latching mechanisms in their unlocked positions, a drive is placed in the tray. The slides are then moved to the locked positions such that the pins on the fasteners engage holes in the drive. The pins secure the drive from movement relative to the tray to facilitate hot plugging of the drive into a computer system.
Adaptable Heat Dissipation Device For A Personal Computer
Mark Cohen - Cary NC, US Joseph Ho-Lung - Wake Forest NC, US Vinod Kamath - Raleigh NC, US Leo Webster - Cary NC, US Tin-Lup Wong - Chapel Hill NC, US
International Classification:
G06F001/20 H05K007/20
US Classification:
361/687000, 361/688000, 361/697000
Abstract:
A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.
Liquid Cooled Memory Module Service Device For Systems With Multiple Memory Module Thicknesses And Methods Of Using The Same
- New Tech Park, SG Jeffrey Holland - Raleigh NC, US Leo Webster - Raleigh NC, US James Womble - Raleigh NC, US
International Classification:
G06F 1/20 H05K 7/20
Abstract:
Devices and methods for adjusting the position of liquid cooling system infrastructure of a computing system comprising liquid-cooled memory modules to provide improved systems and techniques for servicing liquid-cooled memory modules are disclosed herein. According to an aspect, a device includes a table section, a handle on a first side of the table section, and a spreader section on a second side of the table section opposite from the first side, the spreader section further comprising a profile. The profile of the spreader section comprises a first pair of a flat surfaces parallel to each other, defining a first width. The profile of the spreader section further comprises a second pair of flat surfaces parallel to each other, defining a second width perpendicular to the first width, the second width being longer than the first width. The profile of the spreader section also comprises a pair of curved transition sections on opposite corners of the profile, each transition section configured to controlled adjustment with progressive incremental radius increments between an adjacent surface from each of the first pair and second pair of surfaces, such that the device is adapted to insertion with respect to a gap between cooling elements of a double-sided memory module cooling system, and is configured to be rotated to adjust the position of the cooling elements.
Systems Having Fluid Conduit Carriers For Holding Different Portions Of A Fluid Conduit And Methods Of Using The Same
- New Tech Park, SG Jim Drake - Research Triangle Park NC, US Jeffrey Scott Holland - Newton NC, US Vinod Kamath - Raleigh NC, US Timothy Andreas Meserth - Durham NC, US Glenn Myrto - Research Triangle Park NC, US Leo H. Webster - Research Triangle Park NC, US James Scott Womble - Research Triangle Park NC, US Jean J. Xu - Research Triangle Park NC, US
International Classification:
H05K 7/20 G06F 1/20
Abstract:
Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.
Better Boards Contractor For Lenovo
Thermal Engineering Senior Lab Technician
Lenovo Oct 2014 - Sep 2015
Associate Engineer Thermal Engineering Laboratory Operation Manager
Ibm Sep 1986 - Sep 2014
Senior Thermal Lab Technician and Lab Operations Manager
Ibm Apr 1979 - Sep 1986
Manufacturing Engineering Technician
Sonar Radio Mar 1976 - Sep 1978
Supervisor Two Way Radio Final Test and Qc Inspection
Skills:
Project Management Management Software Development Leadership Agile Methodologies Program Management Customer Service Sql Integration Business Analysis Thermal Lab Manager Testing Manufacturing Six Sigma Calibration Quality Control Instrumentation Troubleshooting Engineering Product Development
Bark bark BARK howl! Grr ruff ruff Bark. Aroo, ruff Bark BARK grr. ** Hi, I'm Leo! I'm a Raggle adopted from a local animal shelter. I like chewing sticks, chasing balls, and tussling with my...