Leon A Singleton

US Patent:

20030226877, Dec 11, 2003

Filed:

Jun 5, 2002

Appl. No.:

10/162973

Inventors:

Dean Tran - Westminster CA, US
Salim Akbany - Diamond Bar CA, US
Maurice Lowery - Los Angeles CA, US
Leon Singleton - Fullerton CA, US
Ronald DePace - Mission Viejo CA, US

International Classification:

B23K031/00

US Classification:

228/180210, 219/261000, 219/256000

Abstract:

A chip or die attachment process and related apparatus, in which a desired quantity of solder (or ) is dispensed onto each, in turn, of a number of desired locations on a substrate (or ), and then an integrated-circuit chip () is precisely positioned at each location immediately after the solder is dispensed at that location. Hot gas heaters are used both to heat the solder (or ) as it is dispensed onto the substrate (or ), and to heat the integrated-circuit chip () and to reflow the solder beneath the chip. In one form of the invention, the solder is dispensed from a wire spool () and melted in position on the substrate (). Alternatively, the solder is dispensed as a drop () from a liquid solder reservoir ().