Leslie V Stark

US Patent:

6583515, Jun 24, 2003

Filed:

Sep 1, 2000

Appl. No.:

09/654540

Inventors:

Richard D. James - Plano TX
Leslie E. Stark - Dallas TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2348

US Classification:

257779, 257772, 257780

Abstract:

The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow processâa result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.

US Patent:

6689678, Feb 10, 2004

Filed:

Feb 19, 2003

Appl. No.:

10/370140

Inventors:

Richard D. James - Plano TX
Leslie E. Stark - Dallas TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2144

US Classification:

438612, 436613, 436614, 257730, 257738, 257779

Abstract:

The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow processâa result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.

US Patent:

20020114143, Aug 22, 2002

Filed:

Jan 3, 2002

Appl. No.:

10/034827

Inventors:

Gary Morrison - Garland TX, US
Darvin Edwards - Garland TX, US
Leslie Stark - Dallas TX, US

International Classification:

H05K007/06

US Classification:

361/749000, 361/782000, 174/254000, 257/724000

Abstract:

A vertical stack of semiconductor devices is formed by folding a strip-like flexible interconnector assembled with integrated circuit chips, packages and/or passive components and attaching coupling members solderable to other parts (FIGS. I4A and I4B).

US Patent:

20140054795, Feb 27, 2014

Filed:

Aug 22, 2012

Appl. No.:

13/591719

Inventors:

Matthew David Romig - Richardson TX, US
Lance Cole Wright - Allen TX, US
Leslie Edward Stark - Rowlett TX, US
Frank Stepniak - Allen TX, US
Sreenivasan K. Koduri - Allen TX, US

Assignee:

TEXAS INSTRUMENTS INCORPORATED - Dallas TX

International Classification:

H01L 23/48
H01L 21/50

US Classification:

257777, 438107, 257734, 257E2301, 257E21499

Abstract:

One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

US Patent:

58464760, Dec 8, 1998

Filed:

May 2, 1997

Appl. No.:

8/848942

Inventors:

Ming Hwang - Richardson TX
Leslie E. Stark - Dallas TX
Gail Heinen - Dallas TX
Leo Rimpillo - Baguio City, PH

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

B29C 3508

US Classification:

264493

Abstract:

In semiconductor device assembly operations, the use of an optical heat source 28, such as a tungsten halogen lamp module, is to replace ovens and heater blocks for curing die-attach material and molding compound with reduction in cycle time, cost, footprint, and contamination.

US Patent:

62342967, May 22, 2001

Filed:

Oct 5, 2000

Appl. No.:

9/679146

Inventors:

Gonzalo Amador - Dallas TX
Katherine Gail Heinen - Dallas TX
Jessie Buendia - Richardson TX
Leslie E. Stark - Dallas TX
Chill Go - Baguio, PH

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

B65G 1564

US Classification:

1983453

Abstract:

A system for positioning a carrier relative to a travel path which includes a base having a pair of opposing side walls extending normal to the base and defining a path therebetween. A force applying device is disposed in one of the side walls and extends into the path for applying a force in the direction of the other side wall. A pair of rotatable eccentric members is secured to the other of the walls and extends into the path for selectively positioning a carrier between the eccentric members and the force applying device.

US Patent:

59603070, Sep 28, 1999

Filed:

Nov 5, 1997

Appl. No.:

8/964727

Inventors:

Leslie E. Stark - Dallas TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2144

US Classification:

438612

Abstract:

The invention is to a method for forming solder contact balls for a ball grid array semiconductor package by aligning a sheet of solder (18) on a semiconductor package substrate (15) having a plurality of contact areas (16). A heated wire grid (20,21)is applied to the sheet of solder (18) to separate the solder sheet into a plurality of individual solder plates (22), one each for each contact area (16). Heat is then applied to the solder plates (22) and substrate (15) to melt the solder plates (22) and to reflow the melted solder to form a solder ball (23) at each contact area (16).

US Patent:

59935910, Nov 30, 1999

Filed:

Dec 16, 1997

Appl. No.:

8/991128

Inventors:

Jesus S. Buendia - Richardson TX
Katherine Gail Heinen - Dallas TX
Gonzalo Amador - Dallas TX
Leslie E. Stark - Dallas TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

B32B 3126

US Classification:

1562755

Abstract:

A method and system for curing a die attach material for attachment of a semiconductor die to a leadframe which includes a carrier receiving location for receiving at least one carrier(1) wherein each carrier contains at least one leadframe strip (3) therein, a die attach material (15) on the leadframe strip and a semiconductor die (13) on the die attach material. A heat source (5) is provided for radiating thermal energy to the carrier receiving location. A reflector (9) is disposed around the heat source and the carrier receiving location for reflecting thermal energy from the heat source to the carrier receiving location. A source of flowing cool gas (11) is provided in heat exchange relationship with the reflector for cooling the reflector while heating the gas. The heated gas is passed through the carrier receiving location to provide a source of heat by convection at the carrier receiving location and purge the carrier receiving location of volatiles. The heat source provides radiations principally in the range of from about 0. 5. mu.