Leslie J Stevenson

US Patent:

6348364, Feb 19, 2002

Filed:

Aug 26, 1999

Appl. No.:

09/383733

Inventors:

Victoria J. Bruce - Austin TX
Leslie Stevenson - Cedar Creek TX
Kenneth J. Morrissey - Austin TX
Charles Bachand - Austin TX

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 2144

US Classification:

438108, 438 14, 438734

Abstract:

According to one aspect of the disclosure, the present invention provides methods and arrangements for milling the substrate of a semiconductor device to expose a selected region in the substrate, wherein the semiconductor device has a grid formed in the device to provide lateral and depth position indication during an etch/milling process. In an example implementation, the grid is three dimensional and is used during device analysis for navigation while removing substrate to access a selected circuit area via the backside of flip-chip device. As substrate is removed, the tools are aligned as indicated by the grid.