Li L Li

US Patent:

6337509, Jan 8, 2002

Filed:

Jul 16, 1998

Appl. No.:

09/116368

Inventors:

David N. Cokely - Apalachin NY
Thomas M. Culnane - Lanesboro PA
Lisa J. Jimarez - Newark Valley NY
Miguel A. Jimarez - Newark Valley NY
Li Li - Endicott NY
Donald I. Mead - Montrose PA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23495

US Classification:

257666, 257778, 438108

Abstract:

Fixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity for containing the semiconductor chip and a second cavity in communication with the first cavity for containing the substrate. Whereby the substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween. In a second embodiment the fixture has a first plate having a first opening for disposal of the semiconductor chip therein, a second plate stacked below the first plate and having a thickness substantially equal to the thickness of the substrate, the second plate further having a second opening opposing the first opening for disposal of the substrate therein, and a third plate stacked below the second plate such that the substrate is flattened in the second opening under the weight of the first plate thereby aiding in the attachment of the joining material bumps to their corresponding conductive pads during solder reflow to form electrical connections therebetween. Methods for use of the fixtures is also provided.

US Patent:

6565367, May 20, 2003

Filed:

Jan 17, 2001

Appl. No.:

09/764466

Inventors:

Mark Budman - Vestal NY
Bruce Chamberlin - Vestal NY
Li Li - Plano TX
James Stack - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 1200

US Classification:

439 82, 439161, 439479, 439567

Abstract:

A compliant pin contact and assembly utilizing same in which the contact is comprised of two layers, each of a different material and coefficient of thermal expansion (CTE) than the other, to enable insertion within an opening in either a âcoldâ or âhotâ state to thereby expand and positively engage the openings walls, thereby securedly holding the pin in position. Representative materials include Invar and aluminum.

US Patent:

6524888, Feb 25, 2003

Filed:

Jan 4, 2002

Appl. No.:

10/037536

Inventors:

David N. Cokely - Apalachin NY
Thomas M. Culnane - Lanesboro PA
Lisa J. Jimarez - Newark Valley NY
Miguel A. Jimarez - Newark Valley NY
Li Li - Endicott NY
Donald I. Mead - Montrose PA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144

US Classification:

438108, 438456

Abstract:

Mixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity containing the semiconductor chip and a second cavity for containing the substrate. The substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween.

US Patent:

6747331, Jun 8, 2004

Filed:

Jul 17, 2002

Appl. No.:

10/197335

Inventors:

William Infantolino - Vestal NY
Li Li - Plano TX
Steven G. Rosser - Owego NY
Sanjeev Balwant Sathe - Binghamton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 3100

US Classification:

257457, 257108, 257106

Abstract:

An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid array connection with a flexible substrate in the form of an organic material, which stresses may result in potential delamination due to thermally-induced warpage between the components of the modular arrangement.

US Patent:

7026706, Apr 11, 2006

Filed:

Feb 4, 2004

Appl. No.:

10/771728

Inventors:

William Infantolino - Vestal NY, US
Li Li - Plano TX, US
Steven G. Rosser - Owego NY, US
Sanjeev Balwant Sathe - Binghamton NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/48

US Classification:

257678, 257737, 257778, 438108, 438106, 438457

Abstract:

An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid array connection with a flexible substrate in the form of an organic material, which stresses may result in potential delamination due to thermally-induced warpage between the components of the modular arrangement.

US Patent:

7085716, Aug 1, 2006

Filed:

Oct 26, 2000

Appl. No.:

09/696685

Inventors:

Stijn Van Even - Jamaica Plain MA, US
Li Li - Bedminster NJ, US
Xianju Du - Acton MA, US
Puming Zhan - Acton MA, US

Assignee:

Nuance Communications, Inc. - Burlington MA

International Classification:

G10I 15/26

US Classification:

704235, 704251

Abstract:

A method is described that corrects incorrect text associated with recognition errors in computer-implemented speech recognition. The method includes the step of performing speech recognition on an utterance to produce a recognition result for the utterance. The command includes a word and a phrase. The method includes determining if a word closely corresponds to a portion of the phrase. A speech recognition result is produced if the word closely corresponds to a portion of the phrase.

US Patent:

20060115472, Jun 1, 2006

Filed:

Aug 12, 2005

Appl. No.:

11/203367

Inventors:

Li Li - Sudbury MA, US
Angela Kantor - Pepperell MA, US
Shannon MacMillan - Hollis NH, US

Assignee:

Wyeth - Madison NJ

International Classification:

A61K 39/395

US Classification:

424133100

Abstract:

Formulations are described that are suitable for storage of proteins, such as antibodies, over a relatively broad range of protein concentrations, pH, and buffer types. Also described are methods of storing a protein and methods of identifying a suitable formulation for storage of a specific protein. In general, a formulation contains low to no surfactant, no to relatively low salt concentrations, and requires a relatively low buffer concentration.

US Patent:

20060166251, Jul 27, 2006

Filed:

Jan 26, 2006

Appl. No.:

11/339549

Inventors:

Joanne Archambault - Medford MA, US
Scott Jelinsky - Waltham MA, US
Michael Agostino - Andover MA, US
Li Li - Watertown MA, US
Howard Seeherman - Cambridge MA, US

International Classification:

C12Q 1/68

US Classification:

435006000

Abstract:

The disclosure provides assay systems for evaluating the presence of bone morphogenetic protein (BMP) activity in a cell by evaluating the gene expression of secreted Frizzled Related Protein 2 and 3 (sFRP2 and sFRP3). The sFRP2 and sFRP3 gene expression may be detected at the RNA or protein levels. The methods include methods for evaluating exogenous and endogenous BMP expression and utilize both genomic sFRP2 and sFRP3 genes and reporter constructs.