Lin H Shen

US Patent:

20140048928, Feb 20, 2014

Filed:

Aug 17, 2012

Appl. No.:

13/588544

Inventors:

Li Li - San Ramon CA, US
Subbarao Arumilli - Cupertino CA, US
Lin Shen - Saratoga CA, US

Assignee:

CISCO TECHNOLOGY, INC. - San Jose CA

International Classification:

H01L 23/498

US Classification:

257737, 257E23068

Abstract:

A Multi-Chip Module is presented herein that comprises a package substrate, at least two integrated circuit devices, each of which is electrically coupled to the package substrate, and an interposer. Formed in the interposer are electrical connections which are predominantly horizontal interconnects. The first interposer is arranged to electrically couple the two integrated circuit devices to each other. Methods for manufacturing a Multi-Chip Module are also presented herein.

US Patent:

20200264678, Aug 20, 2020

Filed:

Feb 15, 2019

Appl. No.:

16/277873

Inventors:

- San Jose CA, US
Lin SHEN - San Jose CA, US

International Classification:

G06F 1/20
H05K 7/20

Abstract:

Described herein are baffles for Input/Output (I/O) devices and I/O devices comprising baffles configured to redirect incoming pre-heated air around downstream electrical components and/or their respective heat sinks to prevent overheating. Providing an isolated fresh airflow path from a fluid inlet to such downstream electrical devices reducing such overheating, which prevents malfunctions and increases the I/O efficiency, speed, and lifetime of I/O devices.