Lin Zhang

age ~46

from Dunlap, IL

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Also known as:

Li N Zhang
Lin Pan

Connected to:

Lin Zhang Phones & Addresses

Dunlap, IL
Peoria, IL
Urbana, IL

Education

School / High School:

UC Berkeley SOL Boalt Hall

Ranks

Licence:

California - Active
Date:

2013

Name / Title

Company / Classification

Phones & Addresses

Lin Zhang
Manager

Parkview Heights LLC

Lawyers & Attorneys

Lin Zhang - Lawyer

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Licenses:

California - Active 2013

Education:

UC Berkeley SOL Boalt Hall
Foreign School

Medicine Doctors

Lin Zhang

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Specialties:

Neurology, Neuromuscular Medicine

Work:

UC Davis Medical GroupUC Davis Medical Center Neurology Clinic
3160 Folsom Blvd STE 2100, Sacramento, CA 95816
9167347777 (phone), 9164512010 (fax)

Education:

Medical School
West China Univ of Med Sci, Chengdu City, Sichuan, China
Graduated: 1983

Procedures:

Lumbar Puncture
Neurological Testing
Sleep and EEG Testing

Conditions:

Hemorrhagic stroke
Parkinson's Disease
Alzheimer's Disease
Dementia
Diabetic Peripheral Neuropathy

Languages:

Chinese
English

Description:

Dr. Zhang graduated from the West China Univ of Med Sci, Chengdu City, Sichuan, China in 1983. He works in Sacramento, CA and specializes in Neurology and Neuromuscular Medicine. Dr. Zhang is affiliated with UC Davis Medical Center.

Lin Zhang

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Specialties:

Hematology/Oncology

Work:

Columbus VA Outpatient Clinic
420 N James Rd FL 2, Columbus, OH 43219
6142575200 (phone), 6142575856 (fax)

Chalmers P Wylie VA Ambulatory Care
420 N James Rd, Columbus, OH 43219
6142575602 (phone), 6142575644 (fax)

Education:

Medical School
West China Univ of Med Sci, Chengdu City, Sichuan, China
Graduated: 1988

Conditions:

Anemia
Arterial Thromboembolic Disease
Bipolar Disorder
Cardiac Arrhythmia
Carpel Tunnel Syndrome

Languages:

English

Description:

Dr. Zhang graduated from the West China Univ of Med Sci, Chengdu City, Sichuan, China in 1988. He works in Columbus, OH and 1 other location and specializes in Hematology/Oncology. Dr. Zhang is affiliated with Cincinnati VA Medical Center.

Lin Zhang

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Specialties:

Internal Medicine
Hematology
Medical Oncology

Education:

West China University Of Medical Sciences (1988)
Montefiore Medical Center *Internal Medicine
Wake Forest University Baptist Medical Center *Hematology & Oncology

Us Patents

Fluid Injector With Auxiliary Filling Orifice
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US Patent:

8505514, Aug 13, 2013
Filed:

Mar 9, 2010
Appl. No.:

12/720455
Inventors:

Dianqi Fang - Dunlap IL, US
Lin Zhang - Dunlap IL, US
Stephen Robert Lewis - Chillicothe IL, US
Zhenlong Xu - Peoria IL, US
Avinash R. Manubolu - Edwards IL, US
Shriprasad G. Lakhapati - Glendale Heights IL, US
Christopher D. Hanson - Secor IL, US
Assignee:

Caterpillar Inc. - Peoria IL
International Classification:

F02M 69/04
F02M 43/00
US Classification:

123445, 123478, 2395333
Abstract:

A common rail single fluid injection system including fuel injectors with the ability to produce multiple injection rate shapes. This is accomplished by including auxiliary filling orifices which selectively provide pressurized fluid to the check needle control chamber during injection events. In so doing, the speed and movement of the check needle is manipulated and differing injection rates may be achieved.

Method Of Metallic Component Surface Modification For Electrochemical Applications
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US Patent:

20210254208, Aug 19, 2021
Filed:

Mar 1, 2021
Appl. No.:

17/188571
Inventors:

- PRINCETON NJ, US
Yong TAO - Peoria IL, US
Lin ZHANG - Burlingame CA, US
Gerald A. GONTARZ - Spotswood NJ, US
Assignee:

TREADSTONE TECHNOLOGIES, INC. - PRINCETON NJ
International Classification:

C23C 14/32
C23C 4/02
C23C 4/08
C23C 8/10
C23C 14/16
C23C 28/00
C23F 1/26
C25B 15/00
H01G 9/055
H01G 11/70
H01M 8/0206
H01M 8/0208
H01M 8/0228
C21D 6/00
C21D 9/00
C22C 14/00
C22F 1/18
C23C 4/12
C23C 14/02
C23C 14/35
C23F 1/28
C23F 17/00
H01M 8/021
H01M 8/1018
Abstract:

Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cmand 5 billion cm.

Method Of Metallic Component Surface Modification For Electrochemical Applications
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US Patent:

20200102642, Apr 2, 2020
Filed:

Oct 7, 2019
Appl. No.:

16/594349
Inventors:

- PRINCETON NJ, US
Yong TAO - Peoria IL, US
Lin ZHANG - Burlingame CA, US
Gerald A. GONTARZ - Spotswood NJ, US
Assignee:

TREADSTONE TECHNOLOGIES, INC. - PRINCETON NJ
International Classification:

C23C 14/32
C21D 6/00
C21D 9/00
C22C 14/00
C22F 1/18
C23C 4/12
C23C 14/02
C23C 14/16
C23C 14/35
C23F 1/28
C23F 17/00
H01M 8/021
H01M 8/1018
C23C 4/02
C23C 4/08
C23C 8/10
C23C 28/00
C23F 1/26
C25B 15/00
H01G 9/055
H01G 11/70
H01M 8/0206
H01M 8/0208
H01M 8/0228
Abstract:

Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cmand 5 billion cm.

Method Of Metallic Component Surface Modification For Electrochemical Applications
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US Patent:

20160305011, Oct 20, 2016
Filed:

Apr 15, 2016
Appl. No.:

15/130330
Inventors:

- Princeton NJ, US
Yong TAO - Peoria IL, US
Lin ZHANG - Burlingame CA, US
Gerald A. GONTARZ - Spotswood NJ, US
International Classification:

C23C 14/32
C23C 14/35
C23C 14/02
C23F 1/28
C23F 17/00
C23C 4/12
C21D 6/00
C22C 14/00
C22F 1/18
H01M 8/1018
H01M 8/021
C23C 14/16
C21D 9/00
Abstract:

Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cmand 5 billion cm.