Linda S Mayer

US Patent:

44015275, Aug 30, 1983

Filed:

Aug 20, 1981

Appl. No.:

6/294668

Inventors:

Robert Duva - Paramus NJ
Linda J. Mayer - Denville NJ

Assignee:

Occidental Chemical Corporation - Warren MI

International Classification:

C25D 350

US Classification:

204 47

Abstract:

A process for the electrodeposition of palladium in which palladium is electrodeposited from an aqueous plating bath which contains a bath soluble palladium compound, an electrolyte compound and a nitrite compound in an amount sufficient to provide an excess of free nitrite ions relative to the palladium ions. In a preferred embodiment, the bath also contains a buffering agent to maintain the bath pH at from about 6. 5 to 7. 5. The electrodeposition is carried out using an insoluble anode, while maintaining the excess of free nitrite ions in the bath relative to the palladium ions. In this manner, the plating efficiency of the bath is maintained at a substantially constant, high level for extended periods of plating at current densities in excess of 10 amps per square decimeter.

US Patent:

44119658, Oct 25, 1983

Filed:

Aug 16, 1982

Appl. No.:

6/407661

Inventors:

Donald R. Rosegren - Cresskill NJ
Linda J. Mayer - Denville NJ

Assignee:

Occidental Chemical Corporation - Warren MI

International Classification:

C25D 512

US Classification:

428672

Abstract:

A method of electrodepositing a gold alloy layer having improved corrosion protection is disclosed. Prior to the gold layer an underlayer of ductile, low-stress nickel is electrodeposited from a solution containing ortho-formyl benzene sulfonic acid and perfluorocyclohexyl potassium sulfonate.

US Patent:

43471072, Aug 31, 1982

Filed:

Apr 2, 1981

Appl. No.:

6/250373

Inventors:

Robert J. Teichmann - Belleville NJ
Linda J. Mayer - Denville NJ

Assignee:

Hooker Chemicals & Plastics Corp. - Warren MI

International Classification:

C25D 360

US Classification:

204 44

Abstract:

Improved electroplating bath for depositing bright, metallic tin wherein divalent tin, in the form of stannous sulfate or fluoroborate, is present in conjunction with sulfuric or fluoroboric acid, brighteners including an aromatic amine and an aliphatic aldehyde, a polyalkylene ether surfactant, and an aromatic sulfonic acid to ensure bath stability as well as the requisite brightness. The divalent tin-containing electroplating bath may also be provided with copper or rhodium salts to achieve codeposition of tin with at least one of these alloying metals. The method of utilizing such divalent tin electroplating baths to plate substrates with bright metallic tin is also described and claimed.

US Patent:

44117442, Oct 25, 1983

Filed:

Aug 16, 1982

Appl. No.:

6/407662

Inventors:

Donald R. Rosegren - Cresskill NJ
Linda J. Mayer - Denville NJ

Assignee:

Occidental Chemical Corporation - Warren MI

International Classification:

C25D 312

US Classification:

204 49

Abstract:

Electroplating baths for producing semi-bright, ductile, low stressed nickel deposits in an electrodeposition process utilizing insoluble anodes are disclosed. The nickel baths contain, in addition to nickel salts, ortho-formyl benzene sulfonic acid and perfluorocyclohexyl potassium sulfonate.

US Patent:

43812287, Apr 26, 1983

Filed:

Jun 16, 1981

Appl. No.:

6/274084

Inventors:

Robert J. Teichmann - Belleville NJ
Linda J. Mayer - Denville NJ

Assignee:

Occidental Chemical Corporation - Warren MI

International Classification:

C25D 332
C25D 360

US Classification:

204 44

Abstract:

An electroplating bath for the high speed deposition of bright metallic tin utilizing tin fluoroborate and sulfuric acid as the electrolyte; wherein, in addition to certain other additives, the bath contains a perfluoroalkyl sulfonate wetting agent to promote anode corrosion. Brighteners used in the system include aromatic amines and aliphatic aldehydes. For certain purposes it may be advantageous to include boric acid as part of the electrolyte; and, in other instances, to use an aromatic sulfonic acid to enhance bath stability and brightness. The method for utilizing a bath containing tin fluoroborate in a sulfuric acid matrix containing these perfluoroalkyl sulfonate wetting agents is also described.

US Patent:

45553157, Nov 26, 1985

Filed:

May 29, 1984

Appl. No.:

6/614088

Inventors:

Stephen C. Barbieri - Rutherford NJ
Linda J. Mayer - Denville NJ

Assignee:

OMI International Corporation - Warren MI

International Classification:

C25D 338

US Classification:

204 52R

Abstract:

An improved electrolyte composition and process for electrodepositing bright, level and ductile copper deposits on a substrate enabling use of conventional electroplating equipment for high-speed copper plating employing average cathode current densities substantially higher than heretofore feasible. The electrolyte contains an additive system comprising carefully controlled relative concentrations of: (a) a bath soluble polyether compound; (b) a bath soluble organic divalent sulfur compound; (c) a bath soluble adduct of a tertiary alkyl amine with epichlorohydrin; and (d) a bath soluble reaction product of polyethyleneimine and an alkylating agent.