Linda S Zhang

US Patent:

8580477, Nov 12, 2013

Filed:

Sep 21, 2009

Appl. No.:

12/563627

Inventors:

Brian Knapp - Medina OH, US
Edmund Elce - Lakewood OH, US
Andrew Bell - Lakewood OH, US
Cheryl Burns - Bristolville OH, US
Sridevi Kaiti - North Royalton OH, US
Brian Kocher - North Canton OH, US
Hendra Ng - Highland Heights OH, US
Yogesh Patel - Mansfield OH, US
Masanobu Sakamoto - Medina OH, US
Xiaoming Wu - Lexington KY, US
Linda Zhang - Brecksville OH, US

Assignee:

Promerus LLC - Brecksville OH

International Classification:

G03F 7/038
C08L 45/00

US Classification:

4302701, 430905, 526281

Abstract:

Embodiments in accordance with the present invention encompass negative-tone, aqueous base developable, self-imageable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays.

US Patent:

20060041093, Feb 23, 2006

Filed:

Aug 16, 2005

Appl. No.:

11/204685

Inventors:

Ramakrisha Ravikiran - Strongsville OH, US
Rajesh Puthenkovilakom - North Rovalton OH, US
Linda Zhang - Broadview Heights OH, US
Dino Amoroso - Medina OH, US
Brian Knapp - Medina OH, US
Andrew Bell - Lakewood OH, US
Larry Rhodes - Silver Lake OH, US

International Classification:

C08F 36/00

US Classification:

526282000, 526280000

Abstract:

Polymeric compositions for semiconductor applications comprising 10 to 99 wt. % of norbornene-type cycloolefin monomers represented by one or more of Formulae I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt. % of an addition polymerization procatalyst, and optionally: up to 0.5 wt. % of a cocatalyst, up to 59 wt. % of a crosslinking monomer, up to 50 wt. % of a viscosifier, up to 20 wt. % of a thixotropic additive(s), up to 80 wt. % of a filler, up to 10 wt. % of an antioxidant, and up to 0.6 wt. % of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.