Long T Nguyen

US Patent:

20070008654, Jan 11, 2007

Filed:

Jul 8, 2005

Appl. No.:

11/177547

Inventors:

Samuel Ho - Fremont CA, US
Long Nguyen - Fremont CA, US

Assignee:

Riospring, Inc. - Milpitas CA

International Classification:

G11B 5/55

US Classification:

360265100

Abstract:

One embodiment of the present invention is a head stack assembly of a disk drive, which head stack assembly includes: (a) a first contact disposed on a side of the head stack assembly, which first contact is adapted to contact a crash stop of the disk drive to stop the head stack assembly from moving in a first direction; and (b) a second contact disposed on the same side of the head stack assembly, which second contact is adapted to contact the crash stop to prevent the head stack assembly from moving in a second direction different from the first direction.

US Patent:

20130072411, Mar 21, 2013

Filed:

Oct 23, 2012

Appl. No.:

13/658415

Inventors:

Ma. Fatimo Seijo - Hayward CA, US
David Bernhard - Kooskia ID, US
Long Nguyen - San Jose CA, US

Assignee:

ADVANCED TECHNOLOGY MATERIALS, INC. - Danbury CT

International Classification:

C11D 3/30
C11D 3/32
C11D 3/33

US Classification:

510175

Abstract:

A semiconductor wafer cleaning formulation, including 1-35% wt. fluoride source, 20-60% wt. organic amine(s), 0.1-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 20-50% wt. water, and 0-21% wt. metal chelating agent(s). The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.

US Patent:

20130206168, Aug 15, 2013

Filed:

May 19, 2011

Appl. No.:

13/698647

Inventors:

Thomas West - Portola Valley CA, US
Stephen Kirtley - Saratoga CA, US
Matt Richardson - Milpitas CA, US
Ken Ponder - Soquel CA, US
John Tocchini - Tracy CA, US
Long Nguyen - San Jose CA, US

Assignee:

THOMAS WEST, INC. - Sunnyvale CA

International Classification:

B08B 1/00

US Classification:

134 6, 15230, 152444, 1510494, 29895213

Abstract:

One aspect of the present invention includes an apparatus for scrubbing substrates such as a roller scrubber. According to one embodiment, the apparatus comprises a scrubbing medium having an axial bore and a mandrel having a section disposed through the axial bore of the scrubbing medium. The mandrel is configured so that it exerts an adjustable axial compression on the scrubbing medium. According to another embodiment, the apparatus comprises a roller scrubber. The roller scrubber comprises a scrubbing medium comprising a plurality of discrete disks having a center hole. The disks are disposed side by side so that the center holes form an axial bore in the scrubbing medium. The combined outer edges of the plurality of disks form a scrubbing surface of the roller scrubber.

US Patent:

20130260657, Oct 3, 2013

Filed:

Apr 1, 2013

Appl. No.:

13/854856

Inventors:

Thomas West - Portola Valley CA, US
Peter McKeever - Sunnyvale CA, US
Kevin Song - San Jose CA, US
Donald Dietz - Mountain View CA, US
Long Nguyen - San Jose CA, US
Matt Richardson - Milpitas CA, US

International Classification:

B24B 37/24
B24B 37/26

US Classification:

451527, 451526, 451532, 51298, 425447

Abstract:

A method for making a polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a polymer precursor. The method also includes forming the polishing pad from at least some of a polymer formed after the polymer precursor has cured. The rotating of the cylinder may be continued until the polymer has cured. The method may include forming at least two distinct layers in the polishing pad by casting and curing sequentially at least two different polymer precursors. A system for manufacturing a polishing pad includes a centrifugal caster adapted to rotate. A polishing pad made by a method is provided.

US Patent:

61311499, Oct 10, 2000

Filed:

Mar 23, 1999

Appl. No.:

9/274568

Inventors:

Manuel Lu - Fremont CA
Long Nguyen - Saratoga CA

Assignee:

Oak Technology, Inc. - Sunnyvale CA

International Classification:

G06F 1200

US Classification:

711167

Abstract:

A novel apparatus and method is disclosed to assure validity of data accessed from synchronous memory during a "read" operation, wherein the synchronous memory is operating synchronously at a high frequency system clock. The invention comprises a programmable delay module which generates a skewed clock signal which is used to clock in data read from the synchronous memory. The programmable delay module generates the skewed clock signal by adding programmable time delays to the system clock signal. The inserted delay increases the data valid window time available for the "read" operation and allows sufficient setup and hold time for valid data to be read by a memory controller.

US Patent:

59467126, Aug 31, 1999

Filed:

Jun 4, 1997

Appl. No.:

8/869083

Inventors:

Manuel Lu - Fremont CA
Long Nguyen - Saratoga CA

Assignee:

Oak Technology, Inc. - Sunnyvale CA

International Classification:

G06F 1200

US Classification:

711167

Abstract:

A novel apparatus and method is disclosed to assure validity of data accessed from synchronous memory during a "read" operation, wherein the synchronous memory is operating synchronously at a high frequency system clock. The invention comprises a programmable delay module which generates a skewed clock signal which is used to clock in data read from the synchronous memory. The programmable delay module generates the skewed clock signal by adding programmable time delays to the system clock signal. The inserted delay increases the data valid window time available for the "read" operation and allows sufficient setup and hold time for valid data to be read by a memory controller.

US Patent:

20150344826, Dec 3, 2015

Filed:

Aug 14, 2015

Appl. No.:

14/826840

Inventors:

- Danbury CT, US
Ma. Fatima Seijo - Hayward CA, US
David Bernhard - Kooskia ID, US
Long Nguyen - San Jose CA, US

International Classification:

C11D 7/10
H01L 21/3213
H01L 21/02
C11D 7/32
C11D 11/00

Abstract:

A semiconductor wafer cleaning formulation, including 1-35% wt. fluoride source, 20-60% wt. organic amine(s), 0.1-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 20-50% wt. water, and 0-21% wt. metal chelating agent(s). The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.

Address:

833 Bridgeway Cir, El Sobrante, CA 94803

VIN:

JTHBE96S670018616

Make:

LEXUS

Model:

GS 350

Year:

2007