Lu Yiqing Zhang

US Patent:

7771666, Aug 10, 2010

Filed:

Dec 16, 2003

Appl. No.:

10/537042

Inventors:

Stephan Claude De La Veaux - Wilmington DE, US
Lu Zhang - Newark DE, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

B01J 12/00
C09C 1/00
C01G 23/047

US Classification:

422129, 422150, 422151, 422158, 423612

Abstract:

The present invention provides a method and apparatus for the controlled synthesis of nanoparticles using a high temperature process. The reactor chamber includes a high temperature gas heated by means such as a plasma torch, and a reaction chamber. The homogenizer includes a region between the reactant inlets and the plasma (the spacer zone) to ensure that feeds from the reactant inlets are downstream of the recirculation zone induced by the high temperature gas. It also includes a region downstream of the reactant inlets that provides a nearly I dimensional (varying only in the axial direction) flow and concentration profile in the reaction zone to produce nanoparticles with narrow size distribution.

US Patent:

8198807, Jun 12, 2012

Filed:

Feb 28, 2008

Appl. No.:

12/072792

Inventors:

Kelvin Nguyen - Rochester NY, US
Michelle Nicole Haase Pastel - Horseheads NY, US
Lu Zhang - Painted Post NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

H01L 51/50

US Classification:

313512

Abstract:

Hermetically-sealed packages for electronic components, e. g. , OLEDs, are provided. The packages have a first glass substrate (), a second glass substrate (), and a wall () that separates the first and second substrates () and hermetically seals the electronic component () between the substrates (). The package has a reduced outer unused area characterized by distances D() and D() at least one of which, and, in certain embodiments, both of which are less than 200 microns, e. g. , one or both of D() and D() is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall ().

US Patent:

8317562, Nov 27, 2012

Filed:

May 16, 2012

Appl. No.:

13/473171

Inventors:

Kelvin Nguyen - Rochester NY, US
Michelle Nicole Haase Pastel - Horseheads NY, US
Lu Zhang - Painted Post NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

H01J 9/24

US Classification:

445 24

Abstract:

Hermetically-sealed packages for electronic components, e. g. , OLEDs, are provided. The packages have a first glass substrate (), a second glass substrate (), and a wall () that separates the first and second substrates () and hermetically seals the electronic component () between the substrates (). The package has a reduced outer unused area characterized by distances D() and D() at least one of which, and, in certain embodiments, both of which are less than 200 microns, e. g. , one or both of D() and D() is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall ().

US Patent:

20060142419, Jun 29, 2006

Filed:

Oct 14, 2005

Appl. No.:

11/251259

Inventors:

Jingjing Xu - Wilmington DE, US
Charles Molnar - Wilmington DE, US
Shekhar Subramoney - Hockessin DE, US
Michael Crawford - Glen Mills PA, US
John Gergely - Avondale PA, US
Lu Zhang - Midlothian VA, US
Edwin Marston - Wilmington DE, US

International Classification:

C09D 11/00
C09D 5/00

US Classification:

523161000, 977900000

Abstract:

The present invention is a dispersion composition comprising (1) a curable mixture of monomers, oligomers, or a combination thereof; and (2) superparamagnetic particles dispersed in the mixture of part (1) and a method for preparing such superparamagnetic particles. The composition of the present invention can be useful as a tool for detecting and/or deterring theft, counterfeiting, or the like in commercial transactions.

US Patent:

20110008593, Jan 13, 2011

Filed:

Jul 9, 2009

Appl. No.:

12/500119

Inventors:

Kelvin Nguyen - Rochester NY, US
Lu Zhang - Painted Post NY, US

International Classification:

B32B 3/10
C03C 17/34
B32B 37/12

US Classification:

428203, 65 602, 156 99

Abstract:

A method for forming a fritted cover sheet for sealing a glass package includes providing a transparent substrate having a sealing surface and a backing surface and forming at least one mask on one of the sealing surface of the substrate or the backing surface of the substrate. A sealing frit may be formed on the sealing surface of the substrate such that the at least one mask is positioned adjacent a perimeter defined by the sealing frit.