Luis A Rosado

US Patent:

20130314920, Nov 28, 2013

Filed:

May 25, 2012

Appl. No.:

13/481147

Inventors:

Myung Ho Park - Boca Raton FL, US
Luis Rosado - Miramar FL, US

International Classification:

H05K 7/20
F21V 29/00

US Classification:

36224902, 174252

Abstract:

Thermally radiating heat sinks are soldered directly beneath individual LEDs and other heat generating electronic components on the opposite side of an FR circuit board and thermally coupled to the heat source through multiple micro-vias. The micro-vias are filled with solder in order to increase the thermal transmission of heat energy through the circuit board to the heat sinks The circuit board thickness is minimized to further reduce the thermal resistance of the transmission path. The method employed facilitates the heat transfer away from high-powered LEDs and other heat generating circuitry without spreading the heat energy to thermally sensitive electronic circuits and without the need for expensive substrates commonly employed to dissipate heat in electronic circuits. The method is adapted for LED lighting circuits and preferably to industry standard bulb sizes such as MR11, MR16, R20, PAR30, PAR38, and PAR56.