Marc S Mccloud

US Patent:

20120176716, Jul 12, 2012

Filed:

Jan 10, 2011

Appl. No.:

12/987219

Inventors:

Kevin P. Roy - West Springfield MA, US
Richard A. Poisson - Avon CT, US
Jay W. Kokas - East Granby CT, US
Edward John Marotta - Longmeadow MA, US
Robert C. Hoeckele - Granby CT, US
Luke T. Orsini - Marlborough CT, US
Marc S. McCloud - Suffield CT, US
Matthew S. Fitzpatrick - Portland CT, US

Assignee:

HAMILTON SUNDSTRAND CORPORATION - Windsor Locks CT

International Classification:

H02H 3/22

US Classification:

361111

Abstract:

A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.