Marcus J Straw

US Patent:

8314410, Nov 20, 2012

Filed:

Apr 7, 2011

Appl. No.:

13/082372

Inventors:

Marcus Straw - Portland OR, US
Mark W. Utlaut - Scappoose OR, US
N. William Parker - Hillsboro OR, US

Assignee:

FEI Company - Hallsboro OR

International Classification:

H01J 37/26
H01J 3/14
H01J 37/00

US Classification:

2504923, 2504921, 2504922, 25049221, 2504931, 250397, 250398

Abstract:

A combined laser and charged particle beam system. A pulsed laser enables milling of a sample at material removal rates several orders of magnitude larger than possible for a focused ion beam. In some embodiments, a scanning electron microscope enables high resolution imaging of the sample during laser processing. In some embodiments, a focused ion beam enables more precise milling of the sample. A method and structure for deactivating the imaging detectors during laser milling enables the removal of imaging artifacts arising from saturation of the detector due to a plasma plume generated by the laser beam. In some embodiments, two types of detectors are employed: type-1 detectors provide high gain imaging during scanning of the sample with an electron or ion beam, while type-2 detectors enable lower gain imaging and endpoint detection during laser milling.

US Patent:

8524139, Sep 3, 2013

Filed:

Jun 30, 2010

Appl. No.:

12/828243

Inventors:

Milos Toth - Portland OR, US
Marcus Straw - Portland OR, US

Assignee:

FEI Compay - Hillsboro OR

International Classification:

B29C 35/08

US Classification:

264400, 264 82, 264 83, 264101, 264102, 2191216, 21912161, 21912162, 21912173

Abstract:

An improved method for laser processing that prevents material redeposition during laser ablation but allows material to be removed at a high rate. In a preferred embodiment, laser ablation is performed in a chamber filled with high pressure precursor (etchant) gas so that sample particles ejected during laser ablation will react with the precursor gas in the gas atmosphere of the sample chamber. When the ejected particles collide with precursor gas particles, the precursor is dissociated, forming a reactive component that binds the ablated material. In turn, the reaction between the reactive dissociation by-product and the ablated material forms a new, volatile compound that can be pumped away in a gaseous state rather than redepositing onto the sample.

US Patent:

8629416, Jan 14, 2014

Filed:

Apr 18, 2012

Appl. No.:

13/449773

Inventors:

Marcus Straw - Portland OR, US
Milos Toth - Portland OR, US
Steven Randolph - Portland OR, US
Michael Lysaght - Tigard OR, US
Mark Utlaut - Scappose OR, US

Assignee:

FEI Company - Hillsboro OR

International Classification:

G21G 5/00

US Classification:

2504923, 2504921, 2504922, 25049221, 25049222

Abstract:

An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.

US Patent:

20100127190, May 27, 2010

Filed:

Nov 26, 2008

Appl. No.:

12/324296

Inventors:

MARCUS STRAW - Portland OR, US
Milos Toth - Portland OR, US
Steven Randolph - Portland OR, US
Michael Lysaght - Tigard OR, US
Mark Utlaut - Scappoose OR, US

Assignee:

FEI COMPANY - Hillsboro OR

International Classification:

A61N 5/00
H01J 3/14

US Classification:

2504923, 250396 R

Abstract:

An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.

US Patent:

20110115129, May 19, 2011

Filed:

Jul 9, 2009

Appl. No.:

13/003450

Inventors:

Marcus Straw - Portland OR, US
Amin Samsavar - Lake Oswego OR, US
Milos Toth - Portland OR, US
Mark Utlaut - Scappoose OR, US

Assignee:

FEI COMPANY - Hillsboro OR

International Classification:

B29C 35/08
B23K 26/36

US Classification:

264400

Abstract:

A charged particle beam and a laser beam are used together to micromachine a substrate. A first beam alters the state of a region of the work piece, and the second beam removes material whose state was altered. In one embodiment, an ion beam can create photon absorbing defects to lower the local ablation threshold, allowing the laser beam to remove material in a region defined by the ion beam. The combination of laser beam and charged particle beam allows the creation of features similar in size to the charged particle beam spot size, at milling rates greater than charged particle processing because of the increased energy provided by the laser beam.

US Patent:

20120103945, May 3, 2012

Filed:

Jul 8, 2009

Appl. No.:

13/003513

Inventors:

Marcus Straw - Portland OR, US
David H. Narum - Banks OR, US
Milos Toth - Portland OR, US
Mark Utlaut - Scappoose OR, US
Guido Knippels - Schijndel, NL
Gerardus Nicolaas Van Veen - Waalre, NL

Assignee:

FEI COMPANY - HILLSBORO OR

International Classification:

B23K 15/02
B23K 26/38

US Classification:

21912135, 21912172, 2191216

Abstract:

Laser processing is enhanced by using endpointing or by using a charged particle beam together with a laser. End-pointing uses emissions, such as photons, electrons, ions, or neutral particles, from the substrate to determine when the material under the laser has changed or is about to change. Material removed from the sample can be deflected to avoid deposition onto the laser optics.

US Patent:

20120112062, May 10, 2012

Filed:

Nov 9, 2010

Appl. No.:

12/942201

Inventors:

Libor Novak - Brno, CZ
Marek Uncovsky - Brno, CZ
Milos Toth - Portland OR, US
Martin Cafourek - Brno, CZ
William Parker - San Jose CA, US
Marcus Straw - Portland OR, US
Mark Emerson - Hillsboro OR, US

Assignee:

FEI COMPANY - Hillsboro OR

International Classification:

G01N 23/22
G21K 5/04

US Classification:

250307, 25044111, 250311, 250310

Abstract:

An environmental cell for a charged particle beam system allows relative motion between the cell mounted on an X-Y stage and the optical axis of the focusing column, thereby eliminating the need for a sub-stage within the cell. A flexible cell configuration, such as a retractable lid, permits a variety of processes, including beam-induced and thermally-induced processes. Photon yield spectroscopy performed in a charged particle beam system and using gas cascade amplification of the photoelectrons allows analysis of material in the cell and monitoring of processing in the cell. Luminescence analysis can be also performed using a retractable minor.

US Patent:

20140054267, Feb 27, 2014

Filed:

Aug 19, 2013

Appl. No.:

13/969892

Inventors:

Marcus Straw - Portland OR, US

Assignee:

FEI Company - Hillsboro OR

International Classification:

B23K 26/12

US Classification:

216 65, 1563455

Abstract:

An improved method for laser processing that prevents material redeposition during laser ablation but allows material to be removed at a high rate. In a preferred embodiment, laser ablation is performed in a chamber filled with high pressure precursor (etchant) gas so that sample particles ejected during laser ablation will react with the precursor gas in the gas atmosphere of the sample chamber. When the ejected particles collide with precursor gas particles, the precursor is dissociated, forming a reactive component that binds the ablated material. In turn, the reaction between the reactive dissociation by-product and the ablated material forms a new, volatile compound that can be pumped away in a gaseous state rather than redepositing onto the sample.