Mark J Crabtree

US Patent:

6582137, Jun 24, 2003

Filed:

Jul 18, 2000

Appl. No.:

09/618532

Inventors:

Mark J. Crabtree - Rocklin CA
Joseph T. Siska - Roseville CA

Assignee:

NEC Electronics, Inc. - Santa Clara CA

International Classification:

G03D 500

US Classification:

396604, 396611, 118 52, 134902, 427240

Abstract:

An apparatus is disclosed for coating a semiconductor wafer with polyimide so that excess polyimide is removed from the wafer edge, back side and coating process area and is conveniently drained. A developer, such as dilute TMAH, that mixes with the excess polyimide is injected into a chamber. The soluble mixture of TMAH and excess polymide may then be drained into a bulk drain, obviating the accumulation of excess polymide in the coater cup. The method is implemented through an assembly that includes a coater cup, spin chuck disposed within the coater cup, and a pair of nozzles intruding into the coater cup at a lower portion of the cup. A fist nozzle operates to inject developing fluid onto the back side of the wafer in the cup, and a second nozzle, positioned nearer the center of the cup and the spin chuck, operates to inject rinsing fluid.

US Patent:

7322225, Jan 29, 2008

Filed:

Nov 8, 2004

Appl. No.:

10/983456

Inventors:

Jason T. Gerbi - Roseville CA, US
Mark J. Crabtree - Rocklin CA, US

Assignee:

NEC Electronics America, Inc. - Santa Clara CA

International Classification:

G01N 23/00

US Classification:

73 37, 73 492, 702 51

Abstract:

An apparatus and method for monitoring pressure within an adhesion promotion unit is provided. The apparatus in one embodiment includes a chamber configured to receive and heat a semiconductor wafer. A vacuum device is in fluid communication with a processing space within the chamber, wherein the vacuum device is configured to create a vacuum within the processing space. A vacuum monitor is also in fluid communication with the processing space, wherein the vacuum monitor generates a first electrical signal if gas pressure within the processing space is below a predetermined value. The apparatus may further include a processor in data communication with the vacuum monitor and the vacuum device. The vacuum device may generate a second electrical signal, and the processor generates a third electrical signal if the vacuum monitor fails to generate the first electrical signal within a predetermined amount of time after the vacuum device generates the second signal.

US Patent:

61719803, Jan 9, 2001

Filed:

Aug 5, 1999

Appl. No.:

9/368562

Inventors:

Mark J. Crabtree - Rocklin CA
Joseph T. Siska - Roseville CA

Assignee:

NEC Electronics, Inc. - Santa Clara CA

International Classification:

H01L 2131
H01L 21469

US Classification:

438781

Abstract:

In a semiconductor device fabrication process, a method of, and apparatus for, coating a semiconductor wafer with polyimide so that excess polyimide is removed from the wafer edge, back side and coating process area and is conveniently drained. The method comprises the injection into the chamber of a developer, such as dilute TMAH, that mixes with the excess polyimide. The soluble mixture of TMAH and excess polyimide may then be drained into a bulk drain, obviating the accumulation of excess polyimide in the coater cup. The method is implemented through an assembly that includes a coater cup, spin chuck disposed within the coater cup, and a pair of nozzles intruding into the coater cup at a lower portion of the cup. A fist nozzle operates to inject developing fluid onto the back side of the wafer in the cup, and a second nozzle, positioned nearer the center of the cup and the spin chuck, operates to inject rinsing fluid.