Mark E Gazze

US Patent:

8257152, Sep 4, 2012

Filed:

Nov 12, 2010

Appl. No.:

12/945557

Inventors:

Andrew R. Wank - Avondale PA, US
Donna M. Alden - Bear DE, US
Joseph K. So - Wilmington DE, US
Robert Gargione - Middletown DE, US
Mark E. Gazze - Lincoln University PA, US
David Drop - West Grove PA, US
Mai Tieu Banh - Oakville, CA
Shawn Riley - Wilmington DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

B24D 11/00

US Classification:

451526, 451527, 451534

Abstract:

The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0. 1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm.

US Patent:

8357446, Jan 22, 2013

Filed:

Nov 12, 2010

Appl. No.:

12/945587

Inventors:

Andrew R. Wank - Avondale PA, US
Donna M. Alden - Bear DE, US
Mark E. Gazze - Lincoln University PA, US
Robert Gargione - Middletown DE, US
Joseph K. So - Wilmington DE, US
David Drop - West Grove PA, US
Mai Tieu Banh - Oakville, CA
Shawn Riley - Wilmington DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

D06N 7/04
B32B 3/26
B24D 18/00
B24D 3/02
C09C 1/68

US Classification:

428147, 4283055, 51293, 51308

Abstract:

The invention provides a plurality of polymeric particles embedded with silicate that include gas-filled polymeric microelements. The gas-filled polymeric microelements have a shell and a density of 5 g/liter to 200 g/liter. The shell having an outer surface and a diameter of 5 μm to 200 μm with silicate particles embedded in the polymer. The silicate particles have an average particle size of 0. 01 to 3 μm. The silicate-containing regions are spaced to coat less than 50 percent of the outer surface of the polymeric microelements; and less than 0. 1 weight percent total of the polymeric microelements is associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric micro elements agglomerated with silicate particles to an average cluster size of greater than 120 μm.

US Patent:

20120117889, May 17, 2012

Filed:

Nov 12, 2010

Appl. No.:

12/945504

Inventors:

Donna M. Alden - Bear DE, US
Andrew R. Wank - Avondale PA, US
Robert Gargione - Middletown DE, US
Mark E. Gazze - Lincoln University PA, US
Joseph K. So - Wilmington DE, US
David Drop - West Grove PA, US
Shawn Riley - Wilmington DE, US
Mai Tieu Banh - Oakville, CA

International Classification:

B24D 11/00

US Classification:

51308

Abstract:

The method provides a method of preparing a silicate-containing polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The method includes introducing a feed stream of gas-filled polymeric microelements into a gas jet. The polymeric microelements have varied densities, varied wall thickness and varied particle size. Passing the gas-filled microelements in the gas jet adjacent a Coanda block, the Coanda block having a curved wall for separates the polymeric microelements with Coanda effect, inertia and gas flow resistance. The coarse polymeric microelements from the curved wall of the Coanda block to clean the polymeric microelements. The polymeric microelements collected contain less than 0.1 weight percent total of the polymeric microelements being associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm. Inserting the cleaned polymeric microelements into a polymeric matrix forms the polishing pad.

US Patent:

20170209979, Jul 27, 2017

Filed:

Jan 22, 2016

Appl. No.:

15/004270

Inventors:

- Newark DE, US
- Midland MI, US
Francis V. Acholla - New Castle DE, US
Andrew Wank - Avondale PA, US
Mark Gazze - Lincoln University PA, US
William A. Heeschen - Midland MI, US
James David Tate - Lake Jackson TX, US
Leo H. Chiang - Pearland TX, US

International Classification:

B24B 49/12
G01N 21/958
G01N 21/59
B24B 37/26
B24B 37/34

Abstract:

A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

US Patent:

20170197290, Jul 13, 2017

Filed:

Jan 12, 2016

Appl. No.:

14/993882

Inventors:

- Newark DE, US
- Midland MI, US
Mark Gazze - Lincoln University PA, US
Scott Chang - Taipei City, TW
Jeff Tsai - Chunan, TW
William A. Heeschen - Midland MI, US
James David Tate - Lake Jackson TX, US
Leo H. Chiang - Pearland TX, US

International Classification:

B24B 37/013
B24B 37/22

Abstract:

A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

US Patent:

20170197295, Jul 13, 2017

Filed:

Jan 12, 2016

Appl. No.:

14/993815

Inventors:

- Newark DE, US
- Midland MI, US
Mark Gazze - Lincoln University PA, US
Scott Chang - Taipei City, TW
Jeff Tsai - Chunan, TW
William A. Heeschen - Midland MI, US
James David Tate - Lake Jackson TX, US
Leo H. Chiang - Pearland TX, US

International Classification:

B24D 18/00
B24B 37/22
G01N 21/94
B26D 7/10
G01N 21/95
G01N 21/88
B29C 59/02
B29C 65/48

Abstract:

A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.