Syed M. Alam - Cambridge MA, US Ibrahim M. Elfadel - Ossining NY, US Kathryn W. Guarini - Yorktown Heights NY, US Meikei Ieong - Wappingers Falls NY, US Prabhakar N. Kudva - New York NY, US David S. Kung - Chappaqua NY, US Mark A. Lavin - Katonah NY, US Arifur Rahman - Freemont CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 29/80
US Classification:
257278, 257E27026, 257E21614, 438455
Abstract:
A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e. g. , silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.
Three Dimensional Integrated Circuit And Method Of Design
Syed M. Alam - Cambridge MA, US Ibrahim M. Elfadel - Ossining NY, US Kathryn W Guarini - Yorktown Heights NY, US Meikei Ieong - Wappingers Falls NY, US Prabhakar N. Kudva - New York NY, US David S. Kung - Chappaqua NY, US Mark A. Lavin - Katonah NY, US Arifur Rahman - Freemont CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 21/30
US Classification:
438455, 438183, 257419
Abstract:
A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e. g. , silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.
Three Dimensional Integrated Circuit And Method Of Design
Syed Alam - Cambridge MA, US Ibrahim Elfadel - Ossining NY, US Kathryn Guarini - Yorktown Heights NY, US Meikei Ieong - Wappingers Falls NY, US Prabhakar Kudva - New York NY, US David Kung - Chappaqua NY, US Mark Lavin - Katonah NY, US Arifur Rahman - Freemont CA, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPERATION - Armonk NY
International Classification:
H01L 29/04
US Classification:
257074000, 257E27026
Abstract:
A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.
Washington National Insurance Company
Insurance Agent
3Cstudios Jan 2011 - Oct 2014
Marketing Director
Att Jan 1999 - Jun 2010
Senior Account Representative
Education:
University of Miami Herbert Business School
Skills:
Business Strategy Microsoft Word Public Relations Powerpoint Microsoft Excel New Business Development Marketing Strategy Bilingual Advertising Brand Development Crm Computer Proficiency
Interests:
Writing Skiing Cooking Exercise Traveling Electronics Sewing Home Improvement Reading Crafts Biking Gourmet Cooking Automobiles Travel Home Decoration
Radio host and former federal lawyer, Mark Lavin posits, "Now the states of Wisconsin and Florida, it appears, have decided that there's no law for them to implement any longer. And they are in fact correct, since the last position of the law as it applies to Obamacare is that there is no law.
Date: Feb 05, 2011
Category: Health
Source: Google
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