Mark Randall Michaels

US Patent:

6765061, Jul 20, 2004

Filed:

Jul 30, 2002

Appl. No.:

10/207158

Inventors:

Lisa Dhar - New Providence NJ
Songvit Setthachayanon - Longmont CO
Melinda Schnoes - Longmont CO
Mark David Michaels - Colorado Springs CO

Assignee:

InPhase Technologies, Inc. - Longmont CO

International Classification:

C08G 1810

US Classification:

525123, 525127, 525131, 522 79, 359 3

Abstract:

Holographic articles having self-sealing properties such as moisture resistance and environmental durability are disclosed. The holographic articles are formed by the reaction of a composition containing an excess amount (i. e. non-stoichiometric amount) of polyisocyanates to polyols. The holographic recording articles exhibit high optical clarity and low scattering.

US Patent:

7112359, Sep 26, 2006

Filed:

Jan 11, 2002

Appl. No.:

10/043939

Inventors:

Lisa Dhar - New Providence NJ, US
Mark David Michaels - Colorado Springs CO, US

Assignee:

InPhase Technologies, Inc. - Longmont CO

International Classification:

B32B 3/02

US Classification:

428 644, 428 401, 428 413, 428 417, 428 419, 428 421, 428212, 428913, 428 641, 428 652, 428 656, 428 666, 428221, 359 1, 359 3, 359 6, 359 24, 156102, 156 99, 369283, 430 1

Abstract:

The present invention provides a method and apparatus for a multilayer optical articles. A method comprises forming a first multilayer article with a first substrate and a second substrate with a first adherent disposed between the first and second substrate. A first surface of a third substrate is then grasped with a first holder and a second adherent is then disposed on one or more surfaces selected from a second surface of the third substrate and a surface of the first multilayer article while the multilayer article is grasped by a second holder. The second adherent is then at least partially cured while the first and second holders maintain their grasp and while the inner surfaces of the first and second holders are in the selected angular relationship to form a second multilayer article.

US Patent:

7229741, Jun 12, 2007

Filed:

May 29, 2003

Appl. No.:

10/446772

Inventors:

Songvit Setthachayanon - Longmont CO, US
Xuan T. Phan - Raleigh NC, US
Mark David Michaels - Colorado Springs CO, US
Benjamin C. Ihas - Boulder CO, US

Assignee:

InPhase Technologies, Inc. - Longmont CO

International Classification:

G03C 1/72
G03H 1/02

US Classification:

4302811, 430 1, 430 2, 4302881, 359 3

Abstract:

A novel liquid photoreactive asymmetric acrylate compound containing sulfur, aromatic moieties, and optionally bromine, and having high dynamic range sensitivity is disclosed. The acrylate compound is a monomer for a photoimageable system. In one embodiment, when about 2–8% by weight of the acrylate compound is dissolved in a two-component urethane matrix system and incorporated in an optical article formed by reacting the two-component urethane matrix system, the optical article shows a sensitivity of about 4 or more and a shrinkage during the formation of the optical article of about 0. 05% versus a sensitivity of 2. 26 and a shrinkage of 0. 13% when tribromophenyl acrylate, a commercial monomer, was used.

US Patent:

7282322, Oct 16, 2007

Filed:

May 29, 2003

Appl. No.:

10/446771

Inventors:

Songvit Setthachayanon - Longmont CO, US
Xuan T. Phan - Raleigh NC, US
Mark David Michaels - Colorado Springs CO, US
Benjamin C. Ihas - Boulder CO, US

International Classification:

G03C 1/72
G03H 1/02

US Classification:

4302811, 430 1, 430 2, 4302881, 359 3

Abstract:

A novel photoimageable system for a two-chemistry system containing liquid photoreactive asymmetric acrylate compound containing sulfur, aromatic moieties, and optionally bromine, and an aluminum salt compound is disclosed. The photoimageable system has high dynamic range (M/#) and sensitivity and unexpectedly high temperature and high humidity resistance. The photoimageable system retains its dynamic range when exposed to 60 C. for 4 weeks while a composition without the aluminum salt compound lost 75% of its dynamic range under similar exposure conditions. In one embodiment, 2-10 weight % of a thio-butylacrylate dissolved in a two-component urethane matrix containing 0. 002 to 1 weight % of the aluminum salt compound showed a dynamic range of greater than 5 for a 200 microns thick sample and retained more than 80% of the dynamic range after 4 weeks exposure at 60 C.

US Patent:

20070082179, Apr 12, 2007

Filed:

Oct 7, 2005

Appl. No.:

11/245911

Inventors:

James Wade - , US
Bradley Sissom - , US
Benjamin Ihas - Boulder CO, US
Mark Michaels - Colorado Springs CO, US
Michael Tackitt - Lyons CO, US
Brian Riley - , US
Lisa Dhar - Broomfield CO, US
Kevin Curtis - Longmont CO, US

International Classification:

B32B 1/00

US Classification:

428174000

Abstract:

A method and apparatus for fabricating a multi-layer optical article includes grasping an outer surface of a first substrate with a first holder, whereby the outer surface of the first substrate is held to an inner surface of the first holder, grasping an outer surface of a second substrate with a second holder, whereby the outer surface of the second substrate is held to an inner surface of the second holder, arranging the inner surfaces of the holders to face one another, arranging at least one spacer element between the holders, disposing an adherent on the inner surface of one of the substrates, moving the holders together such that the holders contact the at least one spacer and the substrates contact the adherent, and at least partially curing the adherent while the inner surfaces of the holders are in a selected angular relationship.

US Patent:

40794890, Mar 21, 1978

Filed:

Dec 30, 1976

Appl. No.:

5/755524

Inventors:

John Lawrence Kowalski - Phoenix AZ
Mark Joseph Michaels - Glendale AZ
Edmund Harold Schieve - Phoenix AZ

Assignee:

Honeywell Information Systems Inc. - Phoenix AZ

International Classification:

H05K 1304
H01L 2172

US Classification:

29 33K

Abstract:

A machine for blanking an integrated circuit chip from a segment of a film strip held in a fixture, forming its leads, and placing the chip on a multilayer substrate. The fixtures are stacked in a magazine which is mounted on the machine. A transfer mechanism transfers one fixture at a time from the magazine to a punch press where the IC chip is blanked from its film segment, and its leads are formed. The punch is retracted, and a multilayer substrate, which is mounted on an X-Y table, is positioned by the table under the punch so that the excised chip is directly above a chip pad and the chip leads are above the chip lead pads of a predetermined chip pad. The punch is lowered to position the chip on its chip pad. The substrate is coated with an adhesive flux to retain the chips and their leads in place. The punch is retracted and the X-Y table is moved to clear the punch press.

US Patent:

40843157, Apr 18, 1978

Filed:

Dec 30, 1976

Appl. No.:

5/755525

Inventors:

Mark Joseph Michaels - Glendale AZ

Assignee:

Honeywell Information Systems Inc. - Phoenix AZ

International Classification:

H01L 2160

US Classification:

29740

Abstract:

A fixture for use in soldering a large number of integrated circuit (IC) chips to a multilayer substrate in a single reflow soldering operation. A multilayer substrate with IC chips and their leads properly positioned on the substrate is placed within the base of the fixture. The force structure portion of the fixture is positioned on the base so that force pins, which are movable with respect to the force structure, can be lowered, or moved toward the substrate to apply the weight of a force pin to each IC chip to be soldered to the substrate. The weight, or force, of a force pin forces the back metal layer of each IC chip and its leads against a chip pad and chip lead pads of the substrate. The substrate is heated to melt, or to reflow, the solder on all the chip pads and chip lead pads. After the leads and back metal layer of each chip are wetted by the solder and while the solder is molten, the force structure is moved away from the base to remove the weight of the force pins from the IC chips.