Mark William Michaels

US Patent:

40794890, Mar 21, 1978

Filed:

Dec 30, 1976

Appl. No.:

5/755524

Inventors:

John Lawrence Kowalski - Phoenix AZ
Mark Joseph Michaels - Glendale AZ
Edmund Harold Schieve - Phoenix AZ

Assignee:

Honeywell Information Systems Inc. - Phoenix AZ

International Classification:

H05K 1304
H01L 2172

US Classification:

29 33K

Abstract:

A machine for blanking an integrated circuit chip from a segment of a film strip held in a fixture, forming its leads, and placing the chip on a multilayer substrate. The fixtures are stacked in a magazine which is mounted on the machine. A transfer mechanism transfers one fixture at a time from the magazine to a punch press where the IC chip is blanked from its film segment, and its leads are formed. The punch is retracted, and a multilayer substrate, which is mounted on an X-Y table, is positioned by the table under the punch so that the excised chip is directly above a chip pad and the chip leads are above the chip lead pads of a predetermined chip pad. The punch is lowered to position the chip on its chip pad. The substrate is coated with an adhesive flux to retain the chips and their leads in place. The punch is retracted and the X-Y table is moved to clear the punch press.

US Patent:

40843157, Apr 18, 1978

Filed:

Dec 30, 1976

Appl. No.:

5/755525

Inventors:

Mark Joseph Michaels - Glendale AZ

Assignee:

Honeywell Information Systems Inc. - Phoenix AZ

International Classification:

H01L 2160

US Classification:

29740

Abstract:

A fixture for use in soldering a large number of integrated circuit (IC) chips to a multilayer substrate in a single reflow soldering operation. A multilayer substrate with IC chips and their leads properly positioned on the substrate is placed within the base of the fixture. The force structure portion of the fixture is positioned on the base so that force pins, which are movable with respect to the force structure, can be lowered, or moved toward the substrate to apply the weight of a force pin to each IC chip to be soldered to the substrate. The weight, or force, of a force pin forces the back metal layer of each IC chip and its leads against a chip pad and chip lead pads of the substrate. The substrate is heated to melt, or to reflow, the solder on all the chip pads and chip lead pads. After the leads and back metal layer of each chip are wetted by the solder and while the solder is molten, the force structure is moved away from the base to remove the weight of the force pins from the IC chips.