Mark A Quesada

US Patent:

6542229, Apr 1, 2003

Filed:

Sep 12, 2001

Appl. No.:

09/950815

Inventors:

Peter J. Kalal - Corning NY 14830
Mark A. Quesada - Horseheads NY 14845

International Classification:

G01N 2141

US Classification:

356128, 436164, 422 8205

Abstract:

Optical sensors and methods are disclosed. The resonance energy transfer between a donor and acceptor pair on a surface is monitored. The change in resonance energy transfer as a function of the change in refractive index of a sensing area disposed between the donor and acceptor pair is utilized to provide various sensing methods and structures.

US Patent:

6579680, Jun 17, 2003

Filed:

Feb 28, 2001

Appl. No.:

09/795158

Inventors:

Anthony Glenn Frutos - Painted Post NY
Joydeep Lahiri - Painted Post NY
Santona Pal - Painted Post NY
Mark A. Quesada - Horseheads NY

Assignee:

Corning Incorporated - Corning NY

International Classification:

C12Q 168

US Classification:

435 6, 435 71, 435 911, 435 912, 4352872, 536 221, 536 231, 536 243, 536 2431, 536 2432, 536 2433

Abstract:

A method for the detection and analysis of genetic polymorphisms using arrays that do not require labeling of a target nucleic acid sequence. Hybridization of a perfectly complementary nucleic acid target sequence to an oligonucleotide probe sequence results in a displacement and complete removal of a hybridized probe sequence from the same oligonucleotide probe sequence by means of a thermo-kinetic reaction. The removal of the hybridized probe sequence, having a quencher element, increases the intensity of emission by an emitter element on the oligonucleotide probe sequence.

US Patent:

6710877, Mar 23, 2004

Filed:

Jul 23, 2001

Appl. No.:

09/911119

Inventors:

Christopher J. Chase - Apalachin NY
Peter J. Kalal - Corning NY
Mark A. Quesada - Horseheads NY
Youchun Shi - Horseheads NY

Assignee:

Corning Incorporated - Corning NY

International Classification:

G01N 2100

US Classification:

356432, 356336, 356445

Abstract:

Methods, apparatus and substrates for the detection of reactions between biomolecules or cells and a second compound are disclosed. The invention detects interactions between ligands and receptors by utilizing detecting the diffusion of a species proximate a sensing area. Absorbance detection and diffraction sensors are utilized to monitor the rate of diffusion from the sensing area.

US Patent:

7285420, Oct 23, 2007

Filed:

Nov 18, 2004

Appl. No.:

10/993565

Inventors:

Norman H. Fontaine - Painted Post NY, US
Prantik Mazumder - Ithaca NY, US
Mark A. Quesada - Horseheads NY, US
Eric J. Mozdy - Elmira NY, US
Po Ki Yuen - Corning NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

G01N 21/00
G01N 35/08
B32B 5/02
G01F 25/00
G01N 31/22
G01N 27/00

US Classification:

436164, 436 52, 436180, 436165, 422 58, 422 8205, 422 8211, 73 134, 73 103, 73 145

Abstract:

A system and method are described herein for self-referencing a sensor that is used to detect a biomolecular binding event and/or kinetics which occur in a sample solution flowing along side a reference solution in a micron-sized deep flow channel.

US Patent:

7615506, Nov 10, 2009

Filed:

Oct 6, 2006

Appl. No.:

11/544262

Inventors:

Bruce Gardiner Aitken - Corning NY, US
Shari Elizabeth Koval - Beaver Dams NY, US
Mark Alejandro Quesada - Horseheads NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

C03C 3/247
C03C 8/08
C03C 8/20
B32B 15/00
B32B 17/00
H01L 23/29

US Classification:

501 44, 501 15, 501 21, 501 24, 428426, 428432, 257794, 257E23118

Abstract:

Tungsten-doped tin-fluorophosphate glasses are described herein which exhibit excellent humidity resistance, thermal resistance, and have a low glass transition temperature which makes them suitable for low temperature sealing applications, such as for encapsulating electronic components. In one embodiment, these glasses comprise 55-75% Sn, 4-14% P, 6-24% O, 4-22% F, and 0. 15-15% W on a weight percent elemental basis.

US Patent:

7722929, May 25, 2010

Filed:

Jun 21, 2007

Appl. No.:

11/820855

Inventors:

Bruce Gardiner Aitken - Corning NY, US
Chong Pyung An - Painted Post NY, US
Mark Alejandro Quesada - Horseheads NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

B05D 3/02
C23C 14/00

US Classification:

4273761, 4273722, 20419229, 20429812

Abstract:

A sealing method for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device (e. g. , a hermetically sealed OLED device) are described herein. The sealing method includes the steps of: (1) cooling an un-encapsulated device; (2) depositing a sealing material over at least a portion of the cooled device to form an encapsulated device; and (3) heat treating the encapsulated device to form a hermetically sealed device. In one embodiment, the sealing material is a low liquidus temperature inorganic (LLT) material such as, for example, tin-fluorophosphate glass, tungsten-doped tin fluorophosphate glass, chalcogenide glass, tellurite glass, borate glass and phosphate glass. In another embodiment, the sealing material is a Sn-containing inorganic oxide material such as, for example, SnO, SnO+POand SnO+BPO.

US Patent:

7749811, Jul 6, 2010

Filed:

Sep 3, 2009

Appl. No.:

12/553469

Inventors:

Bruce Gardiner Aitken - Corning NY, US
Chong Pyung An - Painted Post NY, US
Benjamin Zain Hanson - Big Flats NY, US
Mark Alejandro Quesada - Horseheads NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

H01L 21/00

US Classification:

438115, 501 46, 438106

Abstract:

A method is disclosed for inhibiting oxygen and moisture penetration of a device comprising the steps of depositing a tin phosphate low liquidus temperature (LLT) inorganic material on at least a portion of the device to create a deposited tin phosphate LLT material, and heat treating the deposited LLT material in a substantially oxygen and moisture free environment to form a hermetic seal; wherein the step of depositing the LLT material comprises the use of a resistive heating element comprising tungsten. An organic electronic device is also disclosed comprising a substrate plate, at least one electronic or optoelectronic layer, and a tin phosphate LLT barrier layer, wherein the electronic or optoelectronic layer is hermetically sealed between the tin phosphate LLT barrier layer and the substrate plate. An apparatus is also disclosed having at least a portion thereof sealed with a tin phosphate LLT barrier layer.

US Patent:

7829147, Nov 9, 2010

Filed:

Feb 28, 2008

Appl. No.:

12/072784

Inventors:

Bruce Gardiner Aitken - Corning NY, US
Shari Elizabeth Koval - Beaver Dams NY, US
Mark Alejandro Quesada - Horseheads NY, US

Assignee:

Corning Incorporated - Corning NY

International Classification:

B05D 3/02
C23C 14/00

US Classification:

4273761, 4273722, 20419229, 20429812

Abstract:

A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn-containing inorganic oxide material or a low liquidus temperature inorganic material.