Mark Allen Summers

US Patent:

D461183, Aug 6, 2002

Filed:

Jun 29, 2001

Appl. No.:

29/144388

Inventors:

David R. Hillyard - Phoenix AZ
Bill N. Gallas - Queen Creek AZ
Mark D. Summers - Phoenix AZ
Cory W. Worth - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

1402

US Classification:

D14301

US Patent:

D462075, Aug 27, 2002

Filed:

Jun 29, 2001

Appl. No.:

29/144325

Inventors:

David Hillyard - Phoenix AZ
Mark Summers - Phoenix AZ
Gabe Foltz - Gilbert AZ
Cory Worth - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

1402

US Classification:

D14444

US Patent:

6462948, Oct 8, 2002

Filed:

Jun 25, 2001

Appl. No.:

09/887069

Inventors:

Javier Leija - Chandler AZ
Mark D. Summers - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361697, 361687, 361690, 361694, 361695, 361719, 361720, 257722, 174 161, 174 163, 165 803, 16510433, 165185, 454186

Abstract:

A system and method for cooling multiple microprocessors located on a circuit board containing disk drives, memory and other components. This cooling system and method utilizes a blower connected to an air duct. The air duct is divided into several channels via the placement of one or more walls within their duct. Each channel of the air duct is connected to a separate heat sink affixed to each microprocessor. Ambient air blown into the air duct is divided among the channels and proceeds to absorb heat from each of the heat sinks prior to being expelled from the circuit board. The system and method utilizes minimal space on the circuit board and provides maximum cooling for each microprocessor.

US Patent:

6535387, Mar 18, 2003

Filed:

Jun 28, 2001

Appl. No.:

09/894462

Inventors:

Mark D. Summers - Phoenix AZ
Karl H. Mauritz - Chandler AZ
Amber S. Bedi - Phoenix AZ
William Handley - Chandler AZ
Carol Miller - Gilbert AZ
Javier Leija - Chandler AZ
Daniel Dragoon - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361704, 361707, 361709, 361710, 361718, 361719, 361720, 361721, 257718, 257719, 165 802, 165 803, 165185

Abstract:

The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

US Patent:

D472581, Apr 1, 2003

Filed:

Aug 27, 2001

Appl. No.:

29/147372

Inventors:

Mark D. Summers - Phoenix AZ
Javier Leija - Chandler AZ
Daniel Dragoon - Phoenix AZ
Cory W. Worth - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

1908

US Classification:

D20 10, D14371, D14336

US Patent:

6654241, Nov 25, 2003

Filed:

Jun 29, 2001

Appl. No.:

09/895602

Inventors:

David R. Hillyard - Phoenix AZ
Bill N. Gallas - Queen Creek AZ
Mark D. Summers - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 116

US Classification:

361687, 361683, 361695, 3122231

Abstract:

A novel high availability small foot-print server is described in which four or more separate computer modules and associated power supply and communication connections or other units are clustered together in a single server chassis to occupy a limited amount of space while providing maximum accessibility for administrative, maintenance, installation, or other purposes. Each separate computer module is equipped with its own fan or blower box to provide redundancy in the case of fan or blower box failure. The server chassis is contoured to provide for natural interconnection such that more than one high availability small foot-print server may be stacked together to take up the same amount of floor, shelf, or desk space as a single server.

US Patent:

6762939, Jul 13, 2004

Filed:

Feb 20, 2002

Appl. No.:

10/079181

Inventors:

Mark D. Summers - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361719, 361687, 361737, 165 803, 165165, 257707

Abstract:

A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

US Patent:

6765797, Jul 20, 2004

Filed:

Dec 19, 2002

Appl. No.:

10/324289

Inventors:

Mark D. Summers - Phoenix AZ
Karl H. Mauritz - Chandler AZ
Amber S. Bedi - Phoenix AZ
William Handley - Chandler AZ
Carol Miller - Gilbert AZ
Javier Leija - Chandler AZ
Daniel Dragoon - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361704, 361709, 361710, 174 163, 165 803, 257718, 257719, 257727

Abstract:

The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.