Mark W Watson

US Patent:

7939766, May 10, 2011

Filed:

Jan 6, 2009

Appl. No.:

12/348998

Inventors:

Robert B. Anderson - Largo FL, US
Michael A. Gilbert - Seminole FL, US
Mark W. Watson - New Port Richey FL, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H05K 9/00

US Classification:

174387, 361816

Abstract:

An apparatus for electrically shielding electronic components is provided. The apparatus includes a circuit board having a first surface with a plurality of electronic components mounted on the first surface, the first surface having a first region and a second region. The circuit board comprises a ground plane and a trace on the first surface coupled to at least one electronic component in the first region and coupled to at least one electronic component in the second region. The circuit board also comprising a strip of conductive material on the first surface, the strip of conductive material forming a perimeter around the first region of the circuit board, the strip of conductive material coupled to the ground plane, the strip of conductive material defining at least one gap wherein the trace is oriented through the at least one gap. Additionally, a first filtering device is coupled to the trace on a first side of the gap. The apparatus also includes a cover composed of a conductive material for the first region of the circuit board.

US Patent:

8016022, Sep 13, 2011

Filed:

Nov 27, 2006

Appl. No.:

11/563262

Inventors:

Chad E. Richason - Seminole FL, US
Dean R. Hellickson - Palm Harbor FL, US
Mark W. Watson - New Port Richey FL, US
Allen F. Tuthill - Clearwater FL, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H05K 7/20

US Classification:

165 10, 74 5 R, 165 47, 361700

Abstract:

Systems and methods for passive thermal management using phase change material are provided. In one embodiment, a thermal management method is provided. The method comprises securing an electronics assembly to a mounting surface using a thermally insulative support structure; insulating a phase change material within the support structure; and melting the phase change material to reduce heat transfer from an external environment to the electronics assembly during a high temperature transient thermal condition.