Mark A Wolfe

US Patent:

7152800, Dec 26, 2006

Filed:

Aug 22, 2002

Appl. No.:

10/225956

Inventors:

Indumini Ranmuthu - Plano TX, US
Yukihisa Hirotsugu - Tokyo, JP
Mark Wolfe - Dallas TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G06K 19/06

US Classification:

235492, 330296, 330285

Abstract:

A biasing scheme is disclosed that helps reduce current noise in an associated device, such as, for example, a magneto-resistive device. The biasing scheme provides for setting a resistance path in a preamplifier, which is operative to energize the associated device, based on a biasing current that is to be used with associated device. Alternatively or additionally, the resistance path can be set based on a resistance of the associated device. As a result of setting the resistance path in this manner, noise through the associated device can be mitigated during its energization.

US Patent:

7443023, Oct 28, 2008

Filed:

Sep 21, 2005

Appl. No.:

11/231418

Inventors:

James Wilder - Austin TX, US
Paul Goodwin - Austin TX, US
Mark Wolfe - Round Rock TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H01L 23/34
H01L 21/00
H05K 7/20

US Classification:

257707, 257713, 257717, 257720, 257730, 361704, 361709, 361718, 361749, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

US Patent:

7446410, Nov 4, 2008

Filed:

Nov 18, 2005

Appl. No.:

11/283355

Inventors:

James Wilder - Austin TX, US
Mark Wolfe - Round Rock TX, US
Paul Goodwin - Austin TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H01L 23/34
H01L 21/00
H05K 7/20

US Classification:

257707, 257713, 257717, 257720, 257730, 361704, 361709, 361718, 361749, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

US Patent:

7459784, Dec 2, 2008

Filed:

Dec 20, 2007

Appl. No.:

11/961477

Inventors:

James Wilder - Austin TX, US
Paul Goodwin - Austin TX, US
Mark Wolfe - Round Rock TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H01L 23/34
H01L 21/00
H05K 7/20

US Classification:

257707, 257713, 257717, 257724, 257730, 257E23101, 361709, 361717, 361719, 361749, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

US Patent:

7522421, Apr 21, 2009

Filed:

Jul 13, 2007

Appl. No.:

11/777925

Inventors:

David L. Roper - Austin TX, US
Douglas Wehrly, Jr. - Austin TX, US
Mark Wolfe - Austin TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H05K 7/20

US Classification:

361707, 361704, 361721, 257719, 257724, 165185

Abstract:

Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings diverging from a central axis to create, preferably, a ‘V’-shaped structure provide supportive structure for the populated flex circuitry that is wrapped about an edge of the substrate.

US Patent:

7542297, Jun 2, 2009

Filed:

Oct 19, 2005

Appl. No.:

11/255061

Inventors:

Mark Wolfe - Round Rock TX, US
Paul Goodwin - Austin TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H05K 1/00

US Classification:

361749, 174254

Abstract:

A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.

US Patent:

7626259, Dec 1, 2009

Filed:

Oct 24, 2008

Appl. No.:

12/258189

Inventors:

James Wilder - Austin TX, US
Paul Goodwin - Austin TX, US
Mark Wolfe - Round Rock TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H01L 23/34
H01L 21/00
H05K 7/20

US Classification:

257707, 257713, 257720, 257724, 257 23051, 361709, 361717, 361749, 361760, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

US Patent:

7737549, Jun 15, 2010

Filed:

Oct 31, 2008

Appl. No.:

12/263060

Inventors:

James Wilder - Austin TX, US
Mark Wolfe - Round Rock TX, US
Paul Goodwin - Austin TX, US

Assignee:

Entorian Technologies LP - Austin TX

International Classification:

H01L 23/34
H05K 7/20
H01L 21/00

US Classification:

257707, 257713, 257717, 257724, 257730, 257E23101, 361709, 361717, 361719, 361749, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.