Mark S Wolfe

US Patent:

7443023, Oct 28, 2008

Filed:

Sep 21, 2005

Appl. No.:

11/231418

Inventors:

James Wilder - Austin TX, US
Paul Goodwin - Austin TX, US
Mark Wolfe - Round Rock TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H01L 23/34
H01L 21/00
H05K 7/20

US Classification:

257707, 257713, 257717, 257720, 257730, 361704, 361709, 361718, 361749, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

US Patent:

7446410, Nov 4, 2008

Filed:

Nov 18, 2005

Appl. No.:

11/283355

Inventors:

James Wilder - Austin TX, US
Mark Wolfe - Round Rock TX, US
Paul Goodwin - Austin TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H01L 23/34
H01L 21/00
H05K 7/20

US Classification:

257707, 257713, 257717, 257720, 257730, 361704, 361709, 361718, 361749, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

US Patent:

7459784, Dec 2, 2008

Filed:

Dec 20, 2007

Appl. No.:

11/961477

Inventors:

James Wilder - Austin TX, US
Paul Goodwin - Austin TX, US
Mark Wolfe - Round Rock TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H01L 23/34
H01L 21/00
H05K 7/20

US Classification:

257707, 257713, 257717, 257724, 257730, 257E23101, 361709, 361717, 361719, 361749, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

US Patent:

7522421, Apr 21, 2009

Filed:

Jul 13, 2007

Appl. No.:

11/777925

Inventors:

David L. Roper - Austin TX, US
Douglas Wehrly, Jr. - Austin TX, US
Mark Wolfe - Austin TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H05K 7/20

US Classification:

361707, 361704, 361721, 257719, 257724, 165185

Abstract:

Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings diverging from a central axis to create, preferably, a ‘V’-shaped structure provide supportive structure for the populated flex circuitry that is wrapped about an edge of the substrate.

US Patent:

7542297, Jun 2, 2009

Filed:

Oct 19, 2005

Appl. No.:

11/255061

Inventors:

Mark Wolfe - Round Rock TX, US
Paul Goodwin - Austin TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H05K 1/00

US Classification:

361749, 174254

Abstract:

A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.

US Patent:

7626259, Dec 1, 2009

Filed:

Oct 24, 2008

Appl. No.:

12/258189

Inventors:

James Wilder - Austin TX, US
Paul Goodwin - Austin TX, US
Mark Wolfe - Round Rock TX, US

Assignee:

Entorian Technologies, LP - Austin TX

International Classification:

H01L 23/34
H01L 21/00
H05K 7/20

US Classification:

257707, 257713, 257720, 257724, 257 23051, 361709, 361717, 361749, 361760, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

US Patent:

7737549, Jun 15, 2010

Filed:

Oct 31, 2008

Appl. No.:

12/263060

Inventors:

James Wilder - Austin TX, US
Mark Wolfe - Round Rock TX, US
Paul Goodwin - Austin TX, US

Assignee:

Entorian Technologies LP - Austin TX

International Classification:

H01L 23/34
H05K 7/20
H01L 21/00

US Classification:

257707, 257713, 257717, 257724, 257730, 257E23101, 361709, 361717, 361719, 361749, 438122

Abstract:

Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

US Patent:

8395898, Mar 12, 2013

Filed:

Mar 14, 2011

Appl. No.:

13/047512

Inventors:

Amhad Chamseddine - Round Rock TX, US
Mark Wolfe - Round Rock TX, US

Assignee:

Dell Products, LP - Round Rock TX

International Classification:

H05K 7/20

US Classification:

361700, 361694, 361695

Abstract:

Apparatuses, systems and methods for effective cooling of electronic devices are presented herein. More specifically, embodiments of the present invention comprise one or more heat pipes thermally coupled to electronic components and to a first heat sink and a second heat sink. The heat pipes are constructed to transfer heat generated at the one or more electronic components to the first heat sink and to the second heat sink. The first heat sink is operable to transfer heat energy to the ambient air using dissipation or advection. The second heat sink is able to transfer heat energy to the ambient air using dissipation. A controller is operable to switch between a passive mode of operation and an active mode of operation. The system can operate in a passive mode only in temperatures less than 25 degrees Celsius, can switch operation between a passive mode and an active mode without throttling in temperatures less than 60 degrees Celsius, can switch operation between a passive mode and an active mode in temperatures greater than 60 degrees Celsius while maintaining about 85% or greater maximum processing speed, and can operate in a passive only mode with minimal throttling.